Processing apparatus fabrication

ABSTRACT

A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

The present invention claims priority on U.S. Provisional ApplicationSer. No. 60/919,309 filed Mar. 21, 2007, which is incorporated herein.

The present invention is a continuation-in-part of U.S. patentapplication Ser. No. 11/247,124 filed Oct. 11, 2005, which in turn is acontinuation of U.S. application Ser. No. 10/688,233 filed Oct. 17,2003, now U.S. Pat. No. 6,994,245, all of which are incorporated hereinby reference.

This invention generally relates to a chemical and/or heat processingapparatus, and more particularly to a chemical and/or heat processingapparatus assembled from layers of materials having specificcompositions and/or shapes for used in one or more chemicalapplications, biological applications, and/or energy applications.

BACKGROUND OF INVENTION

The field of energy, chemistry and biology continues to advance at arapid pace. New chemical and biological agents are developed daily inlaboratory settings. New fuel cells and heat exchangers are also beingdeveloped to meet the energy needs of the future. However, conventionalprocessing equipment suffers from a number of disadvantages. It has longbeen recognized in the chemical industry that “scale up” from laboratorybench-scale to commercial production scale is difficult. Resultsachieved in the laboratory are often difficult to duplicate atproduction rates in production facilities. Methods of controlling andoptimizing processes for producing such chemical and biologicalcompounds are becoming better understood. The control of parameters suchas temperature, pressure, mixing conditions, relative volumes ofreactants, and uses of catalysts are also becoming better understood.Traditionally, newly discovered chemical and biological compounds and/orprocesses involving either the production of such compounds, orprocesses involving the use of such compounds, have initially beencarried out in “bench-scale” environments. Promising chemicals,biological agents, and/or processes are ultimately produced in massquantity by application to industrial-scale processes. However, problemsare often encountered in scaling up the process from the laboratory toindustrial-scale production.

Conventional chemical processing equipment typically holds a relativelylarge volume of materials and consequently has a relatively large volumeto surface area ratio. As a result, different portions of the reactantmaterials contained within such equipment are exposed to differenthistories of conditions. In the case of a conventional tank reactor, forexample, even when temperature conditions at the walls of the reactorare well controlled, the portions of the reactants that are not in closeproximity to the walls of the reactor may experience differenttemperature histories, especially if a significant temperature gradientexists, which might occur if the chemical reaction is stronglyexothermic. Rapid stirring of the reactants may reduce this temperaturehistory difference, but will not eliminate it. As a result of thenonhomogeneous temperature history, different portions of the reactantsmay chemically react differently. Undesired reactions may occur inportions of the reactants that are exposed to histories of higher thandesired temperatures. This may result in the production of undesiredwaste products, which may be hazardous and which must be properlydisposed of. In extreme situations reaction rates may accelerate touncontrollable levels, which may cause safety hazards, such as potentialexplosions. If, however, the volume to surface area ratio of theprocessing apparatus is substantially reduced, the degree of precisionof control of homogeneity of temperature history of the reactants can besubstantially improved.

Other common problems associated with moving from bench-scale productionto industrial-scale production involve changes in process conditionsbetween the bench-scale environment and the industrial environment. Forinstance, the temperature of the reactants in a beaker or flask in alaboratory is easier to keep constant than the temperature in aproduction tank having a capacity of hundreds of gallons, as is oftenthe case in a chemical processing plant. In addition, high pressures andtemperatures are easier to maintain in small laboratory sized vesselsthan in much larger vessels used for production scale operation. In manyinstances, it is cost prohibitive or not feasible to scale up a reactionvessel from a bench-scale environment to industrial-scale processes.Variations in other process conditions within a large tank are also moredifficult to control, and frequently affect the quality and yield of thedesired product.

Another aspect of laboratory development of processes to producechemical or biological compounds is that often potentially dangerouschemicals are used to create the desired product. Fires and explosionsin research laboratories and contaminant injury to personnel andproperty are well-known risks, especially in the chemical researchindustry. The risks are not limited only to research, since industrialchemical or biological production facilities also may experience firesand explosions related to chemical production using dangerous chemicals.Often, due to the quantities of chemicals used in industrial-scaleprocesses, such accidents are significantly more devastating in anindustrial setting than similar accidents in a research setting.

The materials of construction of conventional chemical processingapparatus, such as steel and specialty iron alloys, furthermore may besubject to corrosion and wear, may have undesirable effects on catalyticactivity, or may “poison” a catalyst.

It has been recognized that a high degree of flow turbulence enhancesthe ability to rapidly mix two or more reactants together. Rapid mixingis important for fast-acting chemical reactions. A high degree ofturbulence is also known to enhance heat transfer. Thus, a structurehaving both a low volume to surface area ratio and a high degree of flowturbulence can be particularly advantageous for precise control ofcertain types of chemical processing.

Recently, increased attention has been directed to the use ofmicro-reactors for both development and production of chemical andbiological processes. These types of reactors offer several advantages.As stated above, the control of chemical processes within very smallreactors is typically easier than the control of a similar process in alarge-scale production tank. Once a reaction process has been developedand optimized in a micro-reactor, it can be scaled up to industrialproduction level by replicating the micro-reactors in sufficientquantity to achieve the required production output of the process. Ifsuch reactors can be fabricated in quantity, and for a modest cost,industrial quantities of a desired product can be manufactured with acapital expenditure equal to or even less than that of a traditionalchemical production facility. An additional benefit is that because thevolume of material in each individual reactor is small, the effect of anexplosion or fire is minimized, and with proper design, an accident inone reactor can be prevented from propagating to other reactors.

The use of micro-reactors has also resulted in an increase in safety inlaboratory settings. In the research setting, the use of micro-reactorsgenerally results in less exposure to hazardous substances andconditions by research personnel than when using traditional “batchchemistry” equipment, which equipment typically requires the researcherto physically handle chemicals in a variety of glass containers, oftenin the presence of a heat source. An accident in such an environment islikely to increase the risk of exposure to hazardous chemicals, andcause damage to the laboratory. However, when using a micro-reactor, themicro-reactor is typically a self-contained unit that minimizes theresearcher's potential exposure to chemical substances. When using amicro-reactor, the researcher is not required to physically manipulatecontainers of chemical materials to carry out a desired reaction. Assuch, the micro-reactor can be located in an area that will protect theresearcher from an accident that could result in a fire or explosion.

Another area in which micro-reactors offer an advantage overconventional chemical process development and production is in themixing of reactants. A mixing channel of the proper scale encourages alaminar flow of the reactants within the channel and is readilyachievable in a micro-reactor. Laminar flow can enhance mixing bydiffusion, which can eliminate the need to expend energy to physicallystir or agitate the reactants.

Micro reactors are particularly applicable to the pharmaceuticalindustry, which engages in chemical research on many new chemicalcompounds every year, in the effort to find drugs or chemical compoundswith desirable and commercially valuable properties. Enhancing thesafety and efficiency of such research is valuable. When coupled withthe potential that micro-reactors can eliminate the problems of movingfrom bench-scale production to industrial production, it is apparentthat a micro-reactor suitable for use in carrying out a variety ofchemical processes, and having an efficient and low-cost design isdesirable.

Several different designs for micro-reactors have been developed. Someof these designs are disclosed in U.S. Pat. Nos. 3,701,619; 5,534,328;5,580,523; 5,690,763; 5,961,932; 6,192,596; 6,200,536; 6,490,812;6,488,838; 6,989,134; 7,000,427; 7,014,835; and 7,220,390; 7,288,231;and U.S. patent application Nos. 2002/0106311 published Aug. 8, 2002;2002/0048644 published Apr. 25, 2002; and 2003/0091496 published May 15,2003. All of these patents and patent applications are incorporatedherein by reference for teachings concerning reactors, materials used tomanufacture the reactors, techniques used to manufacture the reactors,and catalysts used in association with the reactors.

One example of a micro-reactor is disclosed in U.S. Pat. Nos. 5,534,328and 5,690,763, both of which are incorporated herein by reference. Thesetwo patents describe reactor structures for chemical manufacturing andproduction, fabricated from a plurality of interconnected layers.Generally, each layer has at least one channel or groove formed in itand most include orifices that serve to connect one layer in fluidcommunication with another. These layers are preferably made fromsilicon wafers, because silicon is relatively inert to the chemicalsthat may be processed in the reactor, and because the techniquesrequired to mass produce silicon wafers that have had the requiredchannels and other features etched into their surfaces are well known. Adisadvantage of the micro-reactors described in the two patents stemsfrom the rather expensive and complicated process required formanufacturing the devices. While silicon wafer technology has advancedto the state that wafers having desired surface features can readily bemass produced, the equipment required is capital intensive, and unlessunit production is extremely high, the substantial costs are difficultto offset. While the two patents suggest that other materials can beused to fabricate the layers, such as metal, glass, or plastic, thesurface features required (grooves, channels, etc.) must still be formedin the selected material. The specific surface features taught by thetwo patents require significant manufacturing steps to fabricate. Forinstance, while forming an opening through a material is relativelyeasy, forming a groove or channel that penetrates only part way throughthe material comprising a layer is more difficult, as the manufacturingprocess must not only control the size of the surface feature, but thedepth as well. When forming an opening that completely penetratesthrough a material comprising a layer, depth control does not need to beso precisely controlled. The two patents teach that both openings whichcompletely penetrate the layers, and surface features (grooves/channels)that do not completely penetrate the individual layers are required.Hence, multiple processing steps must be employed in the fabrication ofeach layer, regardless of the material selected.

U.S. Pat. No. 5,580,523, which is incorporated herein by reference,describes a modular micro-reactor that includes a series of modulesconnected in fluid communication, each module having a particularfunction (fluid flow handling and control, mixing, chemical processing,chemical separation, etc.). The patent teaches that the plurality ofmodules are mounted laterally on a support structure, and not stacked.In a preferred embodiment of the invention, silicon wafer technology isagain used to etch channels and/or other features into the surface of asilicon wafer. Other disclosed fabrication techniques include injectionmolding, casting, and micro-machining of metals and semiconductorsubstrates. Again, the processing required to fabricate the individualmodules goes beyond merely forming a plurality of openings into eachcomponent. Furthermore, the lateral layout of the reactor described inthe patent requires a larger footprint (Basis Area) than a stacked platereactor. The reactor requires more modules, thus a larger footprint ofthe entire reactor is required. In contrast, when additional plates areadded to a stacked plate reactor, the footprint of the reactor does notchange, which can be a distinct advantage, as in many work environments,the area an apparatus occupies on a workbench or floor is more valuablethan the vertical height of the apparatus. As such, the disclosedreactor does not minimize the footprints and still does not provideflexibility to add components to customize the reactor for a particularprocess or application.

U.S. Pat. No. 5,961,932, which is incorporated herein by reference,discloses a reactor that is formed from a plurality of ceramic layers,which are connected in fluid communication, and wherein at least onelayer includes a permeable partition. In the preferred embodiment, thepatent describes that channels and passageways are formed in each layer.The particular process involves fabricating the layers from “green” oruncured ceramic, which once shaped as desired, must be sintered. Thesintering process changes the size of the ceramic layer so that thesizes of the features formed into the ceramic layer in the initialstages of production are different from the finished product. Oneproblem with this reactor design is that the dimensions of theindividual components cannot be rigidly controlled during fabricationsince the components shrink. Such shrinkage can negatively affect thedimensions of the finished reactor. As such, precise dimensional controlof fluid pathways in the reactor are difficult to maintain to achievethe desired flow rates through the reactor.

In U.S. patent application No. 2002/0106311 published Aug. 8, 2002entitled “Enhancing Fluid Flow in a Stacked Plate Microreactor,” whichis incorporated herein by reference, a stacked plate chemical reactor inwhich simple plates are stacked together to form the reactor isdisclosed. The stacked plates include openings that define fluidpathways and processing volumes within the stacked plates. In apreferred embodiment, an n-fold internal array is achieved by providinga first group of simple plates defining a reaction unit that includesbypass fluid channels and reaction fluid channels for each reactant,such that a portion of each reactant is directed to subsequent groups ofsimple plates defining additional reaction units. A chemical reactorwith variable output is obtained by reversibly joining reactor stackscomprising irreversibly joined reaction units, these reaction unitsconsisting of a plurality of simple plates. Other embodiments disclosedin the patent application employ at least one of the arrays of parallelfluid channels having different widths, bifurcated fluid distributionchannels to achieve a substantially even flow equipartition for fluidswith varying viscosities flowing within the fluid channels of eachreaction unit.

In several of the prior art reactors identified above, relativelycomplicated manufacturing techniques are required. The manufacture oflayers of silicon material requires a large capital investment.Sintering of a ceramic material requires the precise control of theshrinkage process, or individual components of a desired size cannot beachieved. In all cases, these reactors require complicated structures(for example, fluid channels and reaction channels) to be etched orotherwise fabricated in each layer. Additionally, orifices or passagesalso need to be formed in each layer, so that fluids can move betweenadjacent layers of the reactor. Thus, a series of differentmanufacturing steps typically must be performed for each layer. As such,it is desirable to provide a reactor design offering the advantagesdescribed above, which is relatively simple to manufacture, so as tominimize capital investment in scaling up production from the laboratoryto the industrial production levels.

While a single micro-reactor can produce only a limited volume ofproduct, additional micro-reactors can be added in parallel to increaseproduction capacity. When additional modular micro-reactor units areadded, additional systems for reactant supply, heat transfer mediasupply, and product collection are typically required, which not onlyincrease the complexity of the system, but also require more space forduplicative fluid systems. Furthermore, even minor differences in feedrates for some of the duplicate reactor modules can negatively affectproduct quality. Finally, more sophisticated control and monitoring arerequired to manage additional reaction modules and feed systems. Itwould therefore be desirable to provide a micro-reactor capable ofn-fold parallelization without requiring that additional fluid andcontrol systems be provided.

In an array of identical fluid channels having a single common reactantdistribution channel and a single common product collection channel,with the reactant inlet and the product outlet located at opposite ends,where the common reactant distribution and the common product collectionchannel have the same cross sectional area, if the viscosity of theproduct relative to the reactants is substantially the same, then thepressure drop through the array can be considered the same, and theresulting flow distribution is fairly even, with only slightly lowerflow rates in the central fluid channels. However, the flow distributionthrough such an array is not even if the viscosity of the product issignificantly different from the viscosities of the reactants. When suchan array is employed to process a reaction whose product has asignificantly different viscosity compared to the viscosity of themixture of the nonreacted reactants, broad residence time distributionsresult in the array due to the fact that the pressure drop in the commonreactant distribution channel no longer balances with the pressure dropin the common product collection channel. The flow rates within eachindividual fluid channel in the array are no longer identical. If theviscosity of the product is significantly greater than the viscosity ofthe mixed but nonreacted reactants, then the flow rates in theindividual fluid channels in the array tend to increase across the arrayfor channels closest to the common product outlet. Thus the highest flowrate is experienced in the fluid channel in the array that is closest tothe common product outlet, while the lowest flow rate is experienced inthe fluid channel in the array that is located furthest from the commonproduct outlet. This phenomenon is different if the viscosity of theproduct is less than the viscosity of the mixed but nonreactedreactants. Thus for lower viscosity products, the highest flow rate isexperienced in the fluid channel in the array that is closest to thecommon reactant inlet, while the lowest flow rate is experienced in thefluid channel in the array that is located furthest from the commonreactant inlet. The greater the relative change in viscosity the greaterthe variation in flow rates across the array. This imbalance leads todifferent residence times being associated with different fluidchannels, resulting in an undesirable residence time distribution withinthe whole reaction unit. In certain cases, the additional residence timecan lead to undesired cross reactions, and even clogging of the“slowest” fluid channels. As such, it is desirable to provide amicro-reactor including a plurality of fluid channels that is capable ofprocessing reactant mixtures undergoing a significant viscosity changewithout the above-described residence time distributions and relatedproblems.

For the specific residence time distributions discussed above, relativeto reactant mixtures produced in fluid channels in which a plurality ofdifferent reactants are mixed, only one type of undesirable residencetime distribution is of concern. Residence time distribution problems ofthis type can also arise in fluid channels used to direct reactantsbefore mixing, as well as products for collection. It is desirable toprovide a micro-reactor that includes a plurality of fluid channelsadapted to provide substantially equal residence time distributions forfluid flow within the micro-reactor.

Computer modeling of reactors has increased in popularity due toincreased computer processing power and increased sophistication inmodeling software. As such, reactors are commonly modeled to haveincreased complexity (e.g., various passageway configurations forincreased reactor residence time; passageway configurations tomaintained desired flow patterns, temperature profiles, pressureprofiles, etc.). These complex reactor designs are difficult, if notimpossible, to manufacture and/or are cost prohibitive to manufacture byuse of prior art reactor design techniques. Many chemical manufacturingprocesses also require exposure to catalytic materials to complete thechemical process. Precious metals such as gold, platinum, palladium,iridium, rhodium, silver and the like are used as catalysts in variouschemical reactions. In the past, separate reactors had to be producedthat contained each different catalyst material. The use of a pluralityof reactors resulted in an increase in cost and complexity of a chemicalreactor system.

In the energy area, fuel cells are gaining in popularity. Many differentfuel cell concepts have been developed; however, particle applicationsof some of the fuel cell concepts has been impaired due to the complexdesigns of such fuel cells. Examples of various prior art fuel cellsthat can be improved by the present invention are illustrated in U.S.Pat. Nos. 3,839,091; 3,959,094; 4,373,109; 4,474,652; 4,609,441;4,673,473; 4,861,965; 4,972,064; 5,148,001; 5,376,470; 5,492,777;5,599,638; 5,599,638; 5,656,388; 5,773,162; 5,795,496; 5,888,665;5,928,806; 5,961,863 and 6,653,596; and PCT patent applications WO98/22989; WO 98/45694; WO 99/16137; and WO 99/39841 all of which areincorporated herein by reference.

In view of the current state of the art, there is a need for aprocessing apparatus that can be economically manufactured, canincorporate unique and sophisticated flow patters through the apparatus,and can be design to withstand very low and/or very high temperaturesand/or pressure when such temperatures and/or pressure are required.When the processing apparatus is designed for use as a reactor ormicro-reactor, there is also a need for a reactor or micro-reactor thatcan maintain a desired relatively narrow temperature range for a processwhen desired, has a relatively modest footprint when desired, canprovide desired diffusion mixing, can process reaction mixtures thatform a product with different viscosities when required, can providedesired residence time distributions for fluid flow within themicro-reactor, and/or can include different types of catalyticmaterials.

SUMMARY OF THE INVENTION

The present invention pertains to a processing apparatus and method formanufacturing processing apparatus. The processing apparatus of thepresent invention is particularly suited for use in the reaction ofspecialty chemicals for the pharmaceutical industry, and will bedescribed with particular reference thereto; however, the invention hasmuch broader applications and the processing apparatus in accordancewith the present invention can be used in association with a widevariety of chemical reactions in the chemical, biological, food, and/orpharmaceutical industry, and/or can be used in other or additionalapplications. The processing apparatus of the present invention couldalso or alternatively be used in applications that involve a) theproduction of energy (e.g., fuel cells [e.g., direct oxidation fuelcell, reformer fuel cell, etc.], solar cells, automotive fuel productionfrom natural gas (e.g., Fischer-Tropsch process, etc.), methaneprocessing, methanol production (e.g., methanol from carbon dioxide andhydrogen, etc.), production of alcohols from natural gas (e.g.,methanol, ethanol, etc.), coal gasification processes, hydrogenationprocesses, etc.), b) propulsion systems (e.g., rocket engines, etc.); c)environmental waste processing (e.g., pollution and/or waste controlsystems, landfill gas processing, methanol production from CO₂,reduction of NO_(x) and/or SO_(x) gasses, reduction of bio-waste, waterpurification systems, emissions control [e.g., CO₂ sequestering, etc.],etc.); d) biomedical applications (e.g., enzyme production, etc.), heatexchange application (e.g., furnaces, etc.); and/or f) MEMS technology,etc. The applications listed above are merely a few non-limitingexamples of applications that the processing apparatus of the presentinvention can be used. It will be appreciated that the processingapparatus of the invention can include one or more passageways thatenable fluids and/or solids to at least partially flow through theprocessing apparatus. As such, the present invention encompasses anytype of reactor, vessel, etc. that includes one or more passageways thatare at least partially formed by the novel method and process describedin this invention. In the specialty chemical industry (e.g., thepharmaceutical industry), relatively small amounts of chemical compoundsare manufactured; however, larger reactor vessels are typically used toform these chemicals. Consequently, it is not uncommon for a reactorvessel to be running at 30% or less capacity. During the manufacture ofmany types of specialty chemicals or pharmaceutical agents, catalystsare commonly used to promote the reaction of the chemicals. Commonly,one or more precious metals such as, but not limited to, gold, platinum,palladium, iridium, rhodium, ruthenium, and/or silver, are used ascatalysts. As can be appreciated, other or additional types of metal ornonmetal materials can be used as a catalyst to form the specialtychemical or pharmaceutical agent or other type of product (e.g., cobalt,copper, copper-chromium, copper-alumina, iridium, lead, molybdenum,nickel, osmium, palladium, platinum, rhodium, ruthenium, silver, silveroxide, vanadium, zinc, zinc-chromium oxide, etc.). As can also beappreciated, when the processing apparatus is used to form other typesof material (e.g., methanol from natural gas, methanol from carbondioxide, etc.) and/or is used in other types of applications (e.g., fuelcells, removal of undesired gasses, etc.), the catalyst may or may notinclude a precious metal. For example, anodized aluminum can be used topromote the conversion of natural gas into methanol. The presentinvention also encompasses these non-limiting types of applicationsmention above. In prior art reactors that included a precious metal as acatalyst, each different precious metal that was used as a catalyst wastypically placed in a separate reactor so that the precious metal couldbe later recovered after the catalyst had been at least partially spent.The use of one or more catalysts, each of which were placed in a largereactor vessel, commonly resulted in a large capital expenditure onequipment that was only partially used for the formation of a particularchemical. In addition to the inefficient use of large reactor vesselsduring the manufacture of specialty chemicals, the use of large reactorvessels makes it difficult to maintain and/or control the requiredreaction parameters (e.g., reaction temperature, pressure, mixing rates,flow rates, etc.). The processing apparatus of the present invention isdesigned to overcome these shortcomings of past reactors. The processingapparatus of the present invention can have a modular design; however,this is not required. This modular design, when used, can take manyforms. In one non-limiting modular design, the processing apparatus hasa top or front portion, a middle portion, and a bottom or back portion;however, this is not required. The top or front portion of theprocessing apparatus can be designed to be secured to one or more pipes,tubes or the like that feed the reactants to the processing apparatus;however, this is not required. As can be appreciated, one or morereactants can also or alternatively be feed into the processingapparatus at the middle portion and/or the bottom or back portion of theprocessing apparatus; however, this is not required. As can beappreciated, the reactants are typically in liquid and/or gas form;however, solid reactants and/or some combination of solid, liquid and/orgas can be used. The bottom or back portion of the processing apparatuscan be designed to be secured to one or more pipes, tubes or the likethat direct the reacted reactants from the processing apparatus;however, this is not required. As can be appreciated, one or morereacted reactants can also or alternatively be removed from theprocessing apparatus at the middle portion and/or the top or frontportion of the processing apparatus; however, this is not required.Typically the top or front portion and bottom or back portion of theprocessing apparatus do not contain a catalyst when a catalyst is usedin the processing apparatus; however, a catalyst can be positioned inand/or be formed in the top or front portion and/or bottom or backportion of the processing apparatus if so desired. Typically the top orfront portion and bottom or back portion of the processing apparatus aremade of similar materials; however, this is not required. The middleportion of the processing apparatus typically includes one or morecatalysts, when a catalyst is used in the processing apparatus; howeverthis is not required. Although the processing apparatus has beendescribed as having one or more reactants that are directed into theprocessing apparatus, it can be appreciated that some or all of thematerials directed into the processing apparatus may not change inchemical composition as the materials pass through the processingapparatus. For instance, a portion or all of the processing apparatuscan be designed as a heat exchanger. In such a configuration, the one ormore materials passing into the processing apparatus can be used tosolely transfer heat to another material in and/or about the processingapparatus. In one non-limiting example, the processing apparatus isdesigned to enable heating and/or cooling fluids (e.g., water, glycol,etc.) at least partially passed into the processing apparatus to absorbheat and/or radiate heat as the heating and/or cooling fluids pass intoand at least partially through the heating and/or cooling fluids. In onenon-limiting configuration, the heating and/or cooling fluids could beused has a component of a furnace wherein heat from the combustion ofgas is at least partially transferred to another fluid flowing in theprocessing apparatus and/or to another fluid flowing about theprocessing apparatus. As can be appreciated, the combustion of gas canoccur at least partially outside of and/or inside the processingapparatus.

In one non-limiting aspect of the present invention, the processingapparatus has a modular design. The modular design of processingapparatus enables the components of the processing apparatus to bebetter customized for a particular application. For instance, if aprocessing apparatus was required to handle a flow rate of A liters andbe exposed to a catalyst B for a period of time C, a top or frontportion and a bottom or back portion of the processing apparatus couldbe selected to handle flow rate A and a middle portion that includes oris made of catalyst B and having a sufficient surface area to achieve atime of exposure C would be selected. Alternatively or additionally, ifa processing apparatus was required to handle a flow rate of A litersand needed to be resident in the processing apparatus for a period oftime C, a top or front portion and a bottom or back portion of theprocessing apparatus could be selected to handle flow rate A and amiddle portion that included enough passageways and passageway lengthsin combination with the passageways and passageway lengths of the top orfront portion and a bottom or back portion would be selected to providethe desired residence time. These three components could then be securedtogether to form at least a portion of the processing apparatus. Ifhowever, a processing apparatus was required to handle a flow rate of Aliters and be exposed to a catalyst D for a period of time E and, or adifferent residence time in the processing apparatus was required, thesame top or font portion and a bottom or back portion used in theprevious processing apparatus could be used and a different middleportion that includes or is made of catalyst D and having a sufficientsurface area to achieve a time of exposure E and/or a different middleportion that included the needed passageways and passageway lengthswould then be selected. As such, the modular design of the processingapparatus can be used to increase the versatility of uses for theprocessing apparatus. In one non-limiting embodiment of the invention,the top or front portion and/or the bottom or back portion of theprocessing apparatus can be standardized for broad flow rate ranges andthe middle portion can be customized to achieve the desired flow rateand/or resident times in the middle portion; however, this is notrequired. In this particular non-limiting embodiment, the number ofdifferent components for the top or front portion and the bottom or backportion can be reduced so as to reduce the cost of the modularprocessing apparatus. For instance, three sets of top or front portionsand bottom or back portions could be used wherein set A can handleliquid flow rates of up to 1 liter per minute, set B can handle liquidflow rates of up to 10 liters per minute, and set C can handle liquidflow rates of up to 100 liters per minute. As can be appreciated, theseare merely exemplary flow rate ratings and the one of more sets can havedifferent flow rate ratings. Continuing with the example, if aprocessing apparatus was to be used to handle liquid flow rates of 15-25liters per minute, set B would be selected for use in the processingapparatus and a custom middle portion would then be selected thatincludes passage sizes that would limit the flow rate of liquid throughthe middle portion to about 25 liters per minute. In another example, ifa processing apparatus was to be used to handle liquid flow rates of50-75 liters per minute, set B would again be selected for use in theprocessing apparatus and a custom middle portion would then be selectedthat includes passage sizes that would limit the flow rate of liquidthrough the middle portion to about 75 liters per minute. In stillanother example, if a processing apparatus was to be used to handleliquid flow rates of 0.5 liters per minute, set A would be selected foruse in the processing apparatus and a custom middle portion would thenbe selected that includes passage sizes that would limit the flow rateof liquid through the middle portion to about 0.5 liters per minute. Ascan be appreciated from these examples, a few standard sets of top orfront portions and bottom or back portions can be manufactured for usein a wide variety of processing apparatus designs.

In still another and/or alternative non-limiting aspect of the presentinvention, the size and shape of one or more passageways in one or moreof the portions of the processing apparatus can be selected to achievea) a desire flow profile (e.g., laminar flow, turbulent flow, etc.) ofthe materials through the one or more passageways, b) a desiredresidence time of the materials in the one or more passageways, c) adesired amount of surface area contact between the materials flowingthrough the one or more passageways and the walls and/or surfacefeatures of the one or more passageways, d) the desired amount ofthroughput through the reactor, e) the desired mount of heat transfer toor from the one or more material flowing in and/or about the processingapparatus, and/or f) the desired temperature and/or pressure of the oneor more materials in the processing apparatus. The type of flow profilecan be used to affect the mixing rates of the materials in theprocessing apparatus and/or reaction rate of one or more materials inthe processing apparatus. The number of passageways, the size of thepassageways at various points along the length of the passageway, and/orthe shape (e.g., circular-shaped, oval-shaped, triangular-shaped,diamond-shaped, cone-shaped, square-shaped, rectangular-shaped, otherpolygonal shapes, etc.) of the passageway can be selected to achieve adesired flow profile for the materials pass through the passageways,obtain the desired surface area exposure to the materials passingthrough the passageways, obtain the desired pressure drop in thepassageways, and/or minimize pressure drop in the passageways. Forinstance, it has been found in some applications that a triangularshaped passageway can be used to increase flow rates through thepassageways, minimize pressure drop as materials pass through thepassageways, and in some instances increase the exposure of the walls ofthe passageways to the materials passing through the passageways.Generally, the maximum diameter or cross-sectional width of the one ormore passageways is at least about 0.01 μm, typically at least about 5μm, and more typically at least about 10 μm. The upper limit of themaximum diameter or cross-sectional width of the one or more passagewaysis non-limiting and will generally depend of the use and configurationof the processing apparatus. Typically the upper limit of the maximumdiameter or cross-sectional width of the one or more passageways isabout 500,000 μm, typically up to about 50,000 μm, and more typically upto about 10,000 μm; however, other sizes can be used. For micro-reactorapplications, the maximum diameter or cross-sectional width of one ormore portions of the one or more passageways is generally up to about5000 μm, and typically up to about 2000 μm; however, other sizes can beused. As can be appreciated, the maximum diameter or cross-sectionalwidth of at least one passageway and/or shape of at least one passagewaycan be varied along the length of such passageway. The cross-sectionalarea and/or cross-sectional shape of the one or more passageways can beconstant or varied along the length of the one or more passageways inthe processing apparatus. The walls of the one or more passageways canbe generally smooth or not be smooth. Smooth wall surfaces are generallymore conducive in promoting laminar flow through the passageway.Non-smooth wall surfaces generally are more conducive in promotingnon-laminar flow through the passageway. As such, the wall profile ofthe one or more passageways can be selected to promote the desired typeof flow through the one or more passageways. In addition oralternatively, the wall profile of the one or more passageways can beselected to achieve the desired about of surface area exposure of thewalls of the one or more passageways to the materials that are flowingthrough the one or more passageways. The control of surface areaexposure can be used to control reaction rates and/or other changes tothe materials that pass through one or more passageways in the reactor.As can be appreciated, the configuration of one or more portions of oneor more passageways in the processing apparatus can be designed so as topartially simulate an environment of one or more material flowingthrough a traditional bed or mesh, catalyst, etc. The design andcomplexity of the passageways in the processing apparatus are notlimiting to the present invention. In other words, nearly any passagewaydesign and configuration can be made by the method and process ofmanufacture of the processing apparatus in accordance with the presentinvention.

In yet another and/or alternative non-limiting aspect of the presentinvention, the top or front portion and bottom or back portion of theprocessing apparatus are generally made of a durable material; however,this is not required. The materials can be selected to be non-reactivewith the materials passing through the micro-reactor; however, this isnot required. The materials can also be selected to handle thetemperatures and pressures of the materials passing through theprocessing apparatus, and/or assist in desired heat transfer rates inone or more portions of the processing apparatus however, this is notrequired. As can be appreciated, the top or front portion and bottom orback portion of the processing apparatus can be formed of the same ordifferent materials. As can also be appreciated, the top or frontportion and/or bottom or back portion of the processing apparatus can beformed of one material or formed of multiple materials. In onenon-limiting embodiment of the invention, the materials that can be usedto form the top and/or bottom portions include, but are not limited to,crystalline materials, ceramics, glasses, polymers, composite materials,and/or metals. In another and/or alternative non-limiting embodiment ofthe invention, the top or front portion and/or bottom or back portion ofthe processing apparatus can be made of one or more metals such as, butnot limited to, stainless steel, copper, copper alloys, carbon steel,nickel, nickel alloys, titanium, titanium alloys, aluminum, and aluminumalloys. As can be appreciated, other or additional materials can beused. Although the processing apparatus has been described above to havethree portions, namely a top, bottom and middle portions, it will beappreciated that the processing apparatus can be formed of only one ortwo portions, or be formed or more than three portions. As can also beappreciated, these various portions can include one or more of thematerials and/or configurations discussed in this invention with regardto the top, bottom and/or middle portions of the processing apparatus.

In still another and/or alternative non-limiting aspect of the presentinvention, one or more portions of the processing apparatus can includeone or more catalysts. In many chemical reactions, a catalyst isrequired to promote the reaction of one or more reactants. In systemsthat require a catalyst, the processing apparatus includes one or morecatalysts. As can be appreciated, in systems that do not require acatalyst, the processing apparatus generally does not include one ormore catalysts. Typically the catalyst, when used, is located in themiddle portion of the processing apparatus; however, the catalyst can belocated in other or additional locations in the processing apparatus.The one or more catalyst used in the processing apparatus can form partof the walls of the one or more passageways in the reactor and/or beinserted in one or more passageways of the processing apparatus. Theinserted catalyst can take many different forms such as, but not limitedto, traditionally shaped catalyst inserted in a portion of one or morepassageways, a shell or tube of catalyst inserted in a portion of one ormore passageways, etc. In one non-limiting embodiment of the invention,the processing apparatus includes a single catalyst in one or moreportions of the processing apparatus. The catalyst can be formed onand/or as part of the processing apparatus (e.g., one or more materialsused to form a portion of the processing apparatus also functions as acatalyst; the catalyst is coated, plated, anodized, etc. at leastpartially in one or more passageways in the processing apparatus, etc.)and/or inserted in one or more regions of the processing apparatus(e.g., mesh of catalyst positioned in one or more passageways in theprocessing apparatus, beads and/or particles of catalyst positioned inone or more passageways in the processing apparatus, etc.). In anotherand/or additional non-limiting embodiment of the invention, theprocessing apparatus can include a plurality of catalysts in one or moreportions of the processing apparatus. When more than one catalyst isused, the catalyst can be located in the same and/or different regionsin the processing apparatus. In one non-limiting aspect of thisembodiment, the catalyst can be attached to and/or formed on the wall ofone or more passageways in one or more portions of the processingapparatus. In one specific non-limiting example, at least a portion ofthe walls of one or more passageways include one or more catalysts. Inanother and/or alternative non-limiting aspect of this embodiment, twocatalysts are attached to or formed on at least a portion of the wall ofone or more passageways in one or more portions of the processingapparatus. In one specific non-limiting example, one portion of thewalls of the passageways includes one catalyst and another portion ofthe walls of the passageways includes the other catalyst. As can beappreciated, many various configurations of catalyst in the processingapparatus can be used, and all of these various combinations areincluded in the present invention.

In yet another and/or alternative non-limiting aspect of the presentinvention, one or more portions of the processing apparatus can includeone or more passageways that can be used to at least partiallyfacilitate in the desired reaction of the chemical reactants, when areaction of one or more reactants is to at least partially occur in theprocessing apparatus. Various parameters can be used to control achemical reaction. Such parameters include, but are not limited to,temperature, pressure, flow rate, flow profile (e.g., turbulent flow,laminar flow, etc.), type of catalyst, time of exposure to catalyst,and/or surface area of catalyst exposure. The size of the passagewaysthrough the one or more portions of the processing apparatus can beselected to affect the flow rate, flow profile and/or pressure of thematerial as the materials pass through the one or portions of theprocessing apparatus. The length and/or configuration of the passagewayscan be selected to obtain the amount of time of catalyst exposure to thematerials passing through the processing apparatus, especially when thepassageways include the catalyst.

In still yet another and/or alternative non-limiting aspect of thepresent invention, the processing apparatus can include one or morematerials and/or one or more passageways to obtain a desired temperatureprofile and/or heat exchange properties for the processing apparatus.One or more portions of the processing apparatus can include one or morematerials and/or one or more passageways to facilitate in heat transferbetween 1) one or more portions of the processing apparatus, 2) theprocessing apparatus and fluid and/or material positioned about and/orflowing about one or more portions of the processing apparatus, and/or3) the processing apparatus and one or more other processing apparatusesand/or other devices adjacently positioned to the processing apparatus.The one or more materials used in the processing apparatus and/or theone or more passageways in the processing apparatus can be used to atleast partially regulate the temperature of 1) one or more of thematerials flowing at least partially though the processing apparatus, 2)one or more materials positioned about and/or flowing about theprocessing apparatus, and/or 3) one or more other processing apparatusesand/or other devices adjacently positioned to the processing apparatus.Alternatively or additionally, one or more heating elements (e.g.,heating coil, etc.) can be incorporated in one or more of the portionsof the processing apparatus to regulate the temperature of one or moreof the materials in the processing apparatus. For example, when one ormore reactions are to occur in the processing apparatus, the temperatureof one or more reactants in the processing apparatus can be at leastpartially controlled and/or the heat of reaction can be at leastpartially controlled to achieve the desired reaction and/or rate ofreaction in the processing apparatus.

In another non-limiting example, when the processing apparatus is usedat least partially as a heat exchanger, the materials or the processingapparatus; the number and/or size of the passageways in the processingapparatus; and/or the proximity of one or more passageways to oneanother in the processing apparatus can be used to achieve the desiredheat exchange properties of the processing apparatus with relation tomaterials flowing in the processing apparatus and/or about theprocessing apparatus. One or more temperature sensors can beincorporated in one or more of the portions of the processing apparatusto facilitate in the control of the temperature in the processingapparatus, and/or to monitor one or more portions of the processingapparatus; however, this is not required.

In a further and/or alternative non-limiting aspect of the presentinvention, when the processing apparatus has a modular design, one ormore portions of the processing apparatus can be designed so that one ormore portions can be connected together in a manner that allows forlater disconnection. The separation of one or more portions of theprocessing apparatus is advantageous when one or more portions of anunused module can be used to form another processing apparatus. As such,one or more portions of the processing apparatus can be recycled andreused in other processing apparatus, thereby reducing waste andextending the life of one or more portions of the processing apparatus.The separation of the portions of the processing apparatus is alsoadvantageous when the spent or partially spent catalyst in one or moreportions of the processing apparatus is to be recovered, when one ormore portions include a catalyst. When valuable or precious metals areused as the catalyst, the recovery of such metals is desirable. In thepast, the full reactor that included the catalyst was melted down inorder to recover the desired metal catalyst. The processing apparatus ofthe present invention can be designed such that one or more portions ofthe processing apparatus include the catalyst, the processing apparatuscan be separated so as to facilitate in the recovery and/or replacementof the catalyst. As such, when the processing apparatus is taken out ofservice, the processing apparatus can be taken apart and the portioncontaining the catalyst can be removed for recovery of the catalyst. Ifthe processing apparatus includes two or more different catalysts, theportions containing the different catalyst can be separated and thenprocessed in separate recovery processes thereby minimizingcontamination of the recovered catalyst. In prior micro-reactor designs,different catalysts were not placed in the same reactor since duringrecovery of the catalyst, which was typically accomplished by meltingthe catalyst, the inclusion of two or more catalysts would result in thecontamination of the catalysts (e.g., alloying of the catalysts) and/orrequired added steps to separate out the different catalyst resulting inadditional time, complexity and cost. The modular configuration of theprocessing apparatus of the present invention can be used to overcomethis past deficiency of prior art reactors and allow the processingapparatus to be formed having a plurality of different catalysts, whichprocessing apparatus can be later disassembled and one or more of thecatalysts can be separated from the processing apparatus and/or from oneor more other catalyst for separate recovery operations.

In still a further and or alternative non-limiting aspect of the presentinvention, two or more portions of the processing apparatus can be heldtogether by an applied compressive force. When a compressive force isused (e.g., clamps, bolts, etc.), the contact surfaces of the portionsof the processing apparatus are generally smooth so as to increase theseal between the contact surfaces; however, this is not required. In onenon-limiting example, the roughness of the contact surfaces is less thanabout 1-20 micrometers, and substantially free of scratches. Thepressure used to secure the plates together will vary depending on thepressure in the processing apparatus, among other factors. Sealingstructures such as, but not limited to, O-rings and sealing rings can beused to further enhance the seal between contact surfaces.

In yet a further and/or alternative non-limiting aspect of the presentinvention, two or more portions of the processing apparatus can beconnected together by brazing. The brazing metal will generally have amelting point that is less than the metal composition of the portions ofthe processing apparatus being connected together; however, this is notrequired. The brazing metal will also generally be substantially inertto materials passing through the processing apparatus; however, this isnot required. The brazing metal will also generally be able to withstandthe temperature and/or pressures in the processing apparatus. Forinstance, if the processing apparatus includes three components, namelya top portion, a bottom portion and a middle portion, and the contactsurfaces of the top and bottom portion are made of stainless steel andthe middle portion is primarily made of palladium, a brazing metal canbe selected to have a melting point that is less than the melting pointof palladium and stainless steel. Palladium has a melting point of about1554° C. and stainless steel has a melting point of about 2500° C. Assuch, during a brazing process, the middle portion that is formed ofpalladium is most susceptible to damage. By selecting a brazing metalthat is less than the melting point of palladium, the brazing operationfor connecting the components together will not damage or minimizedamage to any of the portions of the processing apparatus. Generally,the melting point of the brazing metal is at least about 50° C. lessthan the lowest melting temperature contact surface typically at leastabout 100° C. less than the lowest melting temperature contact surface,more typically at least about 200° C. less than the lowest meltingtemperature contact surface, and even more typically at least about 300°C. less than the lowest melting temperature contact surface. The samebrazing metal can be used in the processing apparatus or two or moretypes of brazing metal can be used to connect two or more portions ofthe processing apparatus. Non-limiting examples of brazing metals thatcan be used include, but are not limited to, aluminum, copper, chromium,gold, iron, lead, manganese, molybdenum, nickel, niobium, platinum,rhenium, silver, tin, titanium, zinc, zirconium, vanadium, and/orvarious alloys thereof (e.g., nickel-silver alloys [e.g., BAg-3, BAg-4,BAg-7, BAg-13, BAg-22, etc.], nickel alloys [e.g., BNi-1, BNi-2, BNi-3,BNi-8, etc.], gold alloys [e.g., BAu-1, AAu-3, BAu-4, BAu-5, BAu-6,etc.], aluminum-silicon alloys [e.g., BAlSi-2, BAlSi-4, BAlSi-7(d),BAlSi-10(d), etc.], copper alloys [e.g., BCu-1, BCu-2, BCuP-1, etc.],iron alloys [e.g., stainless steel, carbon steel, etc.], 10PdAu,95Ag-5Al, 9Pd-9Ga—Ag, 48Zr-48Ti-4 Be, etc.). As can be appreciated,alloys of these metals and/or other metals can be used. As can beappreciated, some portions of the processing apparatus can be connectedtogether by a brazing metal and other portions of the processingapparatus can be connected by other means (e.g., adhesive, bolts,clamps, rivets, cables, wires, traps, etc.). As can further beappreciated, the brazing metal in combination with another type ofconnector (e.g., bolt, clamp, etc.) can be used to connect together oneor more portions of the processing apparatus. One non-limiting brazingmetal than can be used to connect together palladium and stainless steelis a nickel-silver alloy, which typically has a melting point of lessthan about 1000° C. As can be appreciated, other metals can be used forthe brazing metal. The brazing metal can be applied to the contactsurfaces of the portions of the processing apparatus by plating, metalspraying, hot dipping, brushing, smearing, paste, or other type ofoperation. The heating of the brazing material can occur in an oven, byinduction heating, by lasers, by a torch, by a welder, under highpressure, etc. When the portions of the processing apparatus aredesigned to be separated, the brazing metal can be reheated until itsoftens or becomes molten and one or more portions of the processingapparatus can then be separated from one another. The spent or partiallyspent catalyst in the one or more of the recovered and separatedportions of the processing apparatus can then be processed andrecovered. The one or more portions of the processing apparatus that didnot include the catalyst can be discarded or cleaned and reused to formanother processing apparatus.

In still yet a further and/or alternative non-limiting aspect of thepresent invention, an adhesive can be used to connect one or moreportions of the processing apparatus. When the time has come to separateone or more portions of the processing apparatus and/or to recover thecatalyst in one or more portions of the processing apparatus, a solventcan be used to dissolve the adhesive and enable separation of theportions of the processing apparatus. Many different types of adhesivescan be used (e.g, polyurethane adhesives, etc.).

In still a further and/or alternative non-limiting aspect of the presentinvention, at least one portion of the processing apparatus is formedfrom a plurality of metal layers. The method of manufacturing theprocessing apparatus or one or more portions of the processing apparatusincludes 1) forming sections of the processing apparatus or the one ormore portions of the processing apparatus from a metal material, and 2)connecting a plurality of individual sections to form the processingapparatus or one or more portions of the processing apparatus. Thethickness of the metal layers used in the processing apparatus can bethe same or different. The composition of the metal layers used in theprocessing apparatus can be the same or different. The shape of one ormore metal layers can be modified to form passageway and/or structuresin the processing apparatus. The shape formation of one or more metallayers of the processing apparatus can be accomplished in a variety ofways. In one non-limiting manufacturing process for at least a portionof the processing apparatus, one or more metal layers can be stamped,bent, welded, cast, molded, extruded, die formed and/or die cut, and/orcut (e.g., laser cut, water jet cut, machine tool cut, etc.) from one ormore sheets of metal. One or more of the stamped and/or cut metal layerscan be connected together to another metal layer (which may or may notbe shape formed) by use of an adhesive and/or a brazing metal so as toform one or more portions of the processing apparatus. As can beappreciated, all or a portion of the metal layers that are shape formedcan be shape formed in the same or different manner. In another and/oralternative non-limiting manufacturing process for at least a portion ofthe processing apparatus, one or more metal layers of the processingapparatus can be shape-formed by 1) generating a mechanically drawnand/or computer image of the processing apparatus or one or moreportions of the processing apparatus, 2) sectioning one or more portionsof the mechanical drawn and/or computer-generated image so as torepresent one or more metal layers to be used to at least partially formthe processing apparatus, 3) forming one or more portions of theprocessing apparatus and/or one or more metal layers of the processingapparatus from one or more metal materials based on one or more of thesectioned drawings, and 4) connecting the formed one or more portions ofthe processing apparatus and/or formed one or more metal layers of theprocessing apparatus so as to form the processing apparatus or the oneor more portions of the processing apparatus in a manner such that theformed processing apparatus or formed one or more portions of theprocessing apparatus substantially match the mechanically drawn and/orcomputer generated drawing of the processing apparatus or the one ormore portions of the processing apparatus. By using this novelmanufacturing process, the processing apparatus or the one or moreportions of the processing apparatus can be designed to have veryprecise dimensions that can be manufactured to have very low errortolerances. The computer generated image and/or sections of thecomputer-generated image of the processing apparatus or the one or moreportions of the processing apparatus can be generated by commerciallyavailable or proprietary software. One common commercial softwarepackage is AutoCAD. Many other or additional software packages can beused. The computer generated image and/or sections of thecomputer-generated image is generally at least a two-dimensionaldrawing, and typically a three-dimensional image of the processingapparatus or the one or more portions of the processing apparatus;however, this is not required. Once the computer-generated image matchesthe shape of the processing apparatus or the one or more portions of theprocessing apparatus, the computer-generated image can be then sectionedas desired to emulate one or more layers of the processing apparatus orthe one or more portions of the processing apparatus; however, this isnot required. Typically, the processing apparatus, when divided orsectioned, is at least partially divided or sectioned along thelongitudinal axis or vertical axis of the processing apparatus or theone or more portions of the processing apparatus; however, the graphicsof the processing apparatus or the one or more portions of theprocessing apparatus can be divided along other or additional axes ofthe processing apparatus or the one or more portions of the processingapparatus. The divided or sectioned layers can have the same thickness;however, this is not required. The computer generated images of theprocessing apparatus or the one or more portions of the processingapparatus can be saved, used in other processes (e.g., lithographyprocess, etc.) or the like.

In still yet a further and/or alternative non-limiting aspect of thepresent invention, computer-generated images of the processing apparatusor the one or more portions of the processing apparatus can be used toform one or more metal layers to be used to form at least a portion ofthe processing apparatus. The divided or sectioned computer generatedlayers of the processing apparatus or the one or more portions of theprocessing apparatus can be used to shape form one or more metal layersthat can be matched together with low error tolerances to form one ormore portions of the processing apparatus; however, this is notrequired. Various techniques can be used to form metal layers that matchone or more of the divided or sectioned computer generated layers of theprocessing apparatus or the one or more portions of the processingapparatus. In one non-limiting aspect of this embodiment, lithography isused to at least partially form one or more metal layers that match oneor more of the divided or sectioned computer generated layers of theprocessing apparatus or the one or more portions of the processingapparatus. When using a lithography process, a photosensitive resistantmaterial coating is generally applied to one or more of the surfaces(i.e., either of the relatively large planar “top” or “bottom” surfaces)of a blank of metal material (e.g., thin metal layers, etc.). After theblank has been provided with the photo-resist material coating, “masktools” or “negatives” or “negative masks”, containing a positive ornegative image of the desired sectioned layer of the processingapparatus or the one or more portions of the processing apparatus areetched in the blank of metal material. The mask tools can be made fromglass or other materials, which have a relatively low thermal expansioncoefficient and transmit radiation such as ultraviolet light’ however,this is not required. The blank can then be exposed to radiation,typically in the form of ultraviolet light, to expose the photo-resistcoatings to the radiation. The masks are then removed and a developersolution is applied to the surfaces of the blank to develop the exposed(sensitized) photo-resist material. Once the photo-resist is developed,the blanks are etched or micro-machined. Once etching or machining iscomplete, the remaining unsensitized photo-resist material can beremoved such as by, but not limited to, a chemical stripping solution.When using lithography as a basis for layer fabrication of one or moremetal layers of the processing apparatus or one or more portions of theprocessing apparatus, many different shapes can be formed in the one ormore metal layers. The shapes formed in two or more of the metal layerscan be the same or different. As can be appreciated, the combinations ofany number of shapes in one or more metal layers can result innon-redundant design arrays (i.e., patterns in which not all shapes,sizes, and/or spacings are identical). The lithography can be used tocreate very accurate feature tolerances in the one or more metal layerssince those features can be derived from a potentially high-resolutionphotographic mask. The tolerance accuracy can include line-widthresolution and/or positional accuracy of the plotted features over thedesired area. Photographic masks can assist with achieving high accuracywhen chemical or ion-etched, or deposition-processed layers are beingused to form a processing apparatus or the one or more portions of theprocessing apparatus from the stack of sections. Because dimensionalchanges can occur during the final formation of the processing apparatusor the one or more portions of the processing apparatus, compensationfactors can be engineered at the photo-mask stage, which can betransferred into the fabrication of the processing apparatus or the oneor more portions of the processing apparatus. For instance, when theprocessing apparatus or the one or more portions of the processingapparatus needs to be angled for radial designs or some other design,the photo-mask typically needs to be applied to both sides of the metallayer with a slight offset to allow for the angle. This offset can beused to eliminate a stack-up look even though the steps will be verythin. When the brazing material, adhesive, etc. is coated on one or bothsides of one or more metal layers, the etching solution typicallyperforms a better job to form a better angled stack. In another and/oralternative non-limiting aspect of this embodiment, fabricating of oneor more sections of the processing apparatus or the one or more portionsof the processing apparatus can be formed by one or more micro-machiningtechniques (MEMS); however, this is not required. Some of themicro-machining techniques that can be used include, but are not limitedto, photo-etching, laser machining, reactive ion etching,electroplating, vapor deposition, bulk micro-machining, surfacemicro-machining. As can be appreciated, one or more conventionalmachining techniques can be used to form one or more portions of theprocessing apparatus. Ion etching techniques can be used to form one ormore metal layers of the processing apparatus or the one or moreportions of the processing apparatus that have tolerances of less thanabout 1.25 microns. Photo-chemical-machining techniques can be used toetch one or more metal layers of the processing apparatus or the one ormore portions of the processing apparatus to tolerances of less thanabout 2.5 microns. Laser micro-machining techniques can be used to formone or more metal layers of the processing apparatus or the one or moreportions of the processing apparatus to a tolerance of less than about0.3 micron. Electroforming techniques can be used to form one or moremetal layers of the processing apparatus or the one or more portions ofthe processing apparatus to a tolerance of less than about 0.1 micron.When larger error tolerances are acceptable, various types ofconventional metal machining techniques can be used (e.g., metalstamping, drilling, casting, ultrasonic cutting, water cutting, pressureforming, etching, laser cutting, bore cutting, etc.).

In a further and/or alternative non-limiting aspect of the presentinvention, one or more metal layers of the processing apparatus or theone or more portions of the processing apparatus can be connectedtogether by a lamination process. Once a plurality of the metal layersare formed (generally by one or more of the processing techniques setforth above), at least two of the metal layers of the processingapparatus or the one or more portions of the processing apparatus areplaced together and then laminated together to form the processingapparatus or one or more portions of the processing apparatus. The totalnumber (and thickness) of the metal layers of the processing apparatusor the one or more portions of the processing apparatus define theoverall height and aspect ratio of the processing apparatus or the oneor more portions of the processing apparatus. In one non-limitingembodiment of the invention, a metal-to-metal brazing technique can beused to connect together one or more metal layers of the processingapparatus or the one or more portions of the processing apparatus. Priorto the assembly of the metal layers of the processing apparatus or theone or more portions of the processing apparatus, one or more of themetal layers can have one or both surfaces coated with a thin metalcoating. Such metal coating can be applied by a variety of techniquessuch as, but not limited to, paste, thermal spraying and/orelectroplating. Generally the thickness of the metal coating is lessthan about 1000 microns, typically less than about 100 microns, moretypically about 0.1-10 microns, and even more typically about 0.5-4microns; however, other coating thicknesses can be used. Furthermore,when a metal paste is used, the thickness of the paste layer can be muchgreater than about 10-100 microns. The coated metal typically has amelting temperature that is less than the metal used to form the metallayers of the processing apparatus or the one or more portions of theprocessing apparatus. Generally, the coating metal has an averagemelting point that is at least about 10° C. less than the averagemelting point of the metal used to form the metal layers of theprocessing apparatus or the one or more portions of the processingapparatus; typically, the coating metal has an average melting pointthat is at least about 100° C. less than the average melting point ofthe metal used to form the metal layers of the processing apparatus orthe one or more portions of the processing apparatus; and more typicallyis at least about 300° C. less than the average melting point of themetal used to form the metal layers of the processing apparatus or theone or more portions of the processing apparatus. Examples of coatingmetal materials include, but are not limited to, aluminum, copper,chromium, gold, iron, lead, manganese, molybdenum, nickel, niobium,platinum, rhenium, silver, tin, titanium, zinc, zirconium, vanadium,and/or various alloys thereof (e.g., nickel-silver alloys [e.g., BAg-3,BAg-4, BAg-7, BAg-13, BAg-22, etc.], nickel alloys [e.g., BNi-1, BNi-2,BNi-3, BNi-8, etc.], gold alloys [e.g., BAu-1, AAu-3, BAu-4, BAu-5,BAu-6, etc.], aluminum-silicon alloys [e.g., BAlSi-2, BAISi-4,BAlSi-7(d), BAlSi-10(d), etc.], copper alloys [e.g., BCu-1, BCu-2,BCuP-1, etc.], iron alloys [e.g., stainless steel, carbon steel, etc.],10PdAu, 95Ag-5Al, 9Pd-9Ga—Ag, 48Zr-48Ti-4 Be, etc.). As can beappreciated, alloys of these metals and/or other metals can be used.During the lamination or brazing process, the metal layers and/or metalcoatings are generally heated to an elevated temperature to cause themetal coating to soften and/or flow. The heating atmosphere can be aninert or low reacting atmosphere; however, this is not required. Theheating of the brazing metal can be achieved by use of inductionheating, radiant heating, lasers, furnaces, ovens, torches, electricalresistance, dipping procedures, etc. The atmosphere about the one ormore metal layers during the lamination or brazing process can be undera vacuum to result in a vacuum brazing process; however, this is notrequired. Gas atmospheres that can be used during the brazing processcan include, but are not limited to, nitrogen or noble gases, etc. Thetime of brazing is typically about 0.1-4 hours; however, other times canbe used depending on the brazing temperature, type of brazing metal,composition of the metal layers, etc. The elevated temperature duringbrazing causes the brazing metal to soften and, or flow between themetal layers. Generally, the brazing temperature is at least about 5° C.higher than the melting point of the brazing metal, and typically is atleast about 10° C. higher than the melting point of the brazing metal,and more typically is at least about 50° C. higher than the meltingpoint of the brazing metal, and still more typically is at least about100° C. higher than the melting point of the brazing metal. The brazingprocedure is completed by cooling the heated metal layers. Theatmosphere during cooling process is typically inert; however, this isnot required. The cooling times are typically 0.1-5 hours; however,other cooling times can be used.

In still a further and/or alternative non-limiting aspect of the presentinvention, one or more alignment structures and one or more constructionstructures are used to at least partially orient two or more metallayers to at least partially form the processing apparatus. Astemperatures are elevated during the brazing or lamination process, themetal layers of the processing apparatus or the one or more portions ofthe processing apparatus can expand. Various types of alignmentstructures (e.g., pins, etc.) can be used to maintain the metal layersof the processing apparatus or the one or more portions of theprocessing apparatus in the proper position relative to one anotherduring the brazing or lamination process. Generally, one or moreconstruction structures (e.g., holes, slots, ribs, etc.) are formed inone or more metal layers to facilitate in at least partially aligningtogether two or more metal layers. The construction structures can besized, shaped and/or positioned on the one or more metal layers toaccount for expansion and/or contraction of the metal layers whenexposed to heat during the brazing or lamination process. In onenon-limiting aspect of this embodiment, a plurality of the metal layersinclude one or more construction structures to facilitate in the properorientation of the metal layers when forming the processing apparatus orthe one or more portions of the processing apparatus; however, this isnot required. When one or more construction structures are included inone or more metal layers, one or more alignment structures (e.g., pins,etc.) are used to engage with and/or be at least partially inserted intothe construction structures. For instance, when the constructionstructures are in the form of an opening or slot, the alignmentstructures can be in the form of a pin. These pins can be design so thatthe holes or slots in the metal layers are placed onto the pins therebyresulting in the proper orientation of a plurality of metal layers withrespect to one another. When alignment structures are used, thealignment structures are generally made of the same material as themetal layers so that the alignment structures expand and contact at thesame rate as the metal layers when exposed to heating and cooling;however, this is not required. Alternatively, the alignment structurescan be formed of carbon material (e.g., graphite) or other type ofmaterial that has little or no expansion during heating and cooling. Themetal layers can be clamped together or otherwise placed under pressureto limit movement of the metal layers during the connecting process(e.g., brazing process, etc.); however, this is not required. Inaddition to using alignment structures, positional errors and tolerancesof a plurality of metal layers can be at least partially controlled bythe photographic masks used to produce the metal layers. The geometricsize and tolerance of the metal layers can be partially controlled bythe metal layer thickness and/or micro-machining methods used to producethe metal layers; however, this is not required. When producing alaminated processing apparatus or laminated portion of the processingapparatus, numerous factors can be an influence on the overalltolerances of the metal layers. For example, when using a stackingfixture for the metal layers, the flatness of the laminating surface ofthe metal layers and/or the perpendicularity of the sides of the metallayers can be controlled to ensure improved stacking of the metallayers. In addition, the dimensional tolerance of the alignment featuresof the metal layers and/or the positional tolerance of the metal layerscan be an influence to improve the stacking of the metal layers. In yetanother and/or alternative non-limiting embodiment of the invention, oneor more metal layers can be laminated together by use of an adhesive.Such adhesives can include, but are not limited to, thermo-cured epoxy,non-thermo-cured epoxy, silicone rubber products, urethanes, etc. Whenusing lamination techniques other than brazing, the metal layers of theprocessing apparatus or the one or more portions of the processingapparatus are typically clamped together or otherwise placed underpressure until the adhesive has at least partially dried and/or cured.

In another and/or alternative non-limiting aspect of the invention, themetal layers used to form the processing apparatus or the one or moreportions of the processing apparatus can be made from a wide variety ofmetals. The one or more metal layers can be made of a single metal or beat least partially formed from a metal alloy. The processing apparatusor the one or more portions of the processing apparatus can be formed ofthe same of different metals. In one non-limiting embodiment of theinvention, at least a portion of the top or front portion and/or thebottom or back portion of the processing apparatus is formed one or moremetal layers that are a durable metal. Such durable metals include, butare not limited to, stainless steel (e.g., 304, 316, etc.), nickel,nickel alloys (N02200, N02205, N02270, N04400, N06600, N08800, N10001,etc.) aluminum, aluminum alloys (1160, 1100, 1235, etc.), titanium,titanium alloys (Ti-0.3Mo-0.8Ni, Ti-6Al-4V, Ti-10V-2Fe-3Al, etc.),copper, copper alloys (e.g., brass, etc.). In still another and/oralternative non-limiting aspect of this embodiment, the middle portionor a segment of the middle portion of the processing apparatus can be atleast partially formed from one or more metal layers that can functionas catalyst metal; however, this is not required. Such metal layers thatcan function as a catalyst include, but are not limited to, aluminum,cobalt, copper, gold, iridium, lithium, molybdenum, nickel, platinum,palladium, rhodium, ruthenium and/or silver. As mentioned above, one ormore metal layers can be made fully from a single metal or can be madeof a plurality of metals. Alternatively or additionally, the processingapparatus or one or more portions of the processing apparatus can bemade of one or more metal layers formed of the same or different metal.The thickness of the metal layers can vary depending on the size of theprocessing apparatus, the configuration of the processing apparatus, themetal composition of the processing apparatus in certain locations ofthe processing apparatus, etc. Generally the average thickness of themetal layers is at least about 10 μm, and more typically at least about40 μm. The maximum average thickness of the metal layers is typically nogreater than about 500,000 μm, typically no greater than about 250,000μm, and even more typically no greater and about 25,400 μm; however, itcan be appreciated that thickness of greater than about 500,000 μm canbe used in some applications. As can be appreciated, other thicknessescan be used. When the processing apparatus is in the form ofmicro-reactor, the average thickness of a plurality of metal layers thatform at least a portion of the micro-reactor is generally about 10-5,000μm, typically about 20-2,000 μm, more typically about 30-1,000 μm, andeven more typically about 30-800 μm. As can be appreciated, otherthicknesses can be used. When the processing apparatus is in the form ofmicro-reactor and one or more metal layers are at least partially usedas a catalyst in the form of a precious metal, the average thickness ofthe metal layers is generally at least about 1 μm, typically less thanabout 10,000 μm, more typically about 8-1,000 μm, even more typicallyabout 10-500 μm, still more typically about 15-400 μm, and still evenmore typically about 40-150 μm. As can be appreciated, other thicknessescan be used. When thin thicknesses of the metal layers are used (i.e.,no greater than about 1000 μm), such thin metal layers can be used tofacilitate in the ease of processing the metal layers, such as, but notlimited to, processing the metal layers by a lithography process. Theincreased ease of processing the metal layers can result in a higherquality processing apparatus. As defined in this invention, thin metallayers are metal layers having an average thickness of no greater thanabout 1000 μm.

In still another and/or alternative non-limiting aspect of the presentinvention, the one or more metal layers of processing apparatus or theone or more portions of the processing apparatus can be strategicallypositioned in the stack of metal layers to achieve the desiredproperties of the processing apparatus. For instance, one or more metallayers that can also function as a catalyst can be strategicallypositioned in the stack of metal layers so that one or more passagewaysin the processing apparatus are at least partially formed of thecatalytic metal layers so as to achieve a desired reaction as reactantspass through the passageways of the processing apparatus. Themanufacturing method of the present invention can thus enable theformation of a processing apparatus having a small but intricate andcomplex three-dimensional passageway system through the processingapparatus. Such intricate and complex three-dimensional passagewaysystem can be used to achieve a high reaction surface area to strengthratio; and/or can be used for other or additional reasons. If desired,one or more portions of the processing apparatus can be at leastpartially encased in a durable structure and/or clamped together (e.g.,toggle press or wedge clamp, etc.) to enable the one or more processesin the processing apparatus to safely occur at elevated pressures and/ortemperatures beyond that of which can be achieved using the traditionalcylindrical reactor vessels, plated ceramic catalyst beds and theceramic honeycomb catalyst supports used in the chemical industry today;however, this is not required. The manufacturing process for theprocessing apparatus of the present invention also enables the materialspassing through the processing apparatus to be exposed to multiplecatalysts as the materials pass through the processing apparatus, ifsuch a configuration is desired. As a result, the processing apparatuscan be used to eliminate the need for multiple reactor vessels in arefinery. Increasing chemical production by use of the processingapparatus of the present invention merely requires adding additionalprocessing apparatus to the system. As a result, the processingapparatus eliminates the need of installing large vessel reactors onlineto anticipate increased demand in the future (which large reactorsresult in underutilization of the reactor). In addition, chemicalprocessing by use of the processing apparatus can be safer, cleaner,more accurate and efficient at the pressures and temperatures ascompared to larger reactor vessels. Recovery of the catalyst, especiallya precious metal catalyst, is much simpler in the processing apparatusof the present invention than melting the entire reactor down (when itbecomes plugged or deficient) and separating the elements at theirperspective melt and density points or using various highly toxicmethods of reduction now in use at most of the catalyst producers (e.g.,separating the precious metal from the ceramic supports). The method ofrecovery of the catalyst in the processing apparatus of the presentinvention, when a catalyst is used, can be not only simpler and lesscostly, it can also be much more environmentally friendly. Changeover ofcatalyst beds when using the processing apparatus of the presentinvention can be done unit by unit while still under processingconditions instead of shutting down whole reactor vessels to change outtons of catalyst.

In still another and/or alternative non-limiting aspect of the presentinvention, the processing apparatus can be used as a heat exchanger. Theprocessing apparatus can be used to create a high efficiency heatexchanger; however, this is not required. In one non-limiting embodimentof the invention, the heat exchanger includes a plurality of metallayers that are laminated together. The lamination process is typicallya metal brazing process. The heat exchanger includes one or morepassageways to enable a fluid to flow through the passageway. In onenon-limiting aspect of this embodiment, the heat exchanger is in theform of a furnace element that is designed to burn a gas (e.g., naturalgas, hydrogen, methane, etc.) so as to generate heat that can betransferred to a fluid that flows at least partially through and/orabout one or more portions of the heat exchanger. In one non-limitingspecific example, the furnace element is designed to burn natural gas.This furnace element can be place in a conventional home heating unit;however, this is not required. In such non-limiting example, the furnaceelement is formed of a plurality of metal layers that are laminatedtogether. Typically the lamination is by use of a brazing metal. Themetal layers can be formed of the same or different material. Generally,at least one of the metal layers includes a high heat conductive metalto facilitate in the transfer of heat in the furnace element.Non-limiting examples of such materials includes aluminum, aluminumalloys, copper, copper alloys, stainless steel, etc. As can beappreciated, other or additional metals can be used. The metal layerscan have the same or different thicknesses. Generally the thickness ofthe metal layers is less than about 4 inches (101,600 microns); however,this is not required. One or more of the metal layers include one ormore channels and/or passageways so that when the metal layers areconnected together, the furnace element includes one or morepassageways. When a brazing metal is used to connect together two ormore metal layers so as to at least partially form the furnace element,the brazing metal has a melting point that is generally at least 100° C.less than the metal point of the metal layers that the brazing metal isto be used to connect together. For example, if two copper metal layersare to be connected together, the brazing metal would generally have amelting point of less than about 983° C. Non-limiting examples of suchmetals include aluminum, lead, tin, zinc, and alloys thereof. The typeof metal for the metal layers and the brazing metal is generally 50° C.greater than the highest anticipated operating temperature of thefurnace element. For example, if the highest furnace element temperatureis anticipated to be about 590-650° C., the melting point of the metallayers and the brazing material generally should be at least about 700°C. Non-limiting examples of such metals include brass, bronze, copper,carbon steel, stainless steel, etc. As such, if a copper layer and steellayer was used to form at least a portion of the furnace element, abrazing material such as brass and/or bronze can be used. As can beappreciated, many other types of metal layers and/or brazing metals canbe used. As can also be appreciated, different portions of the furnaceelement may be exposed to different temperatures. For example, theportion of the furnace element wherein the natural gas is burned isgenerally the highest temperature portion of the furnace element. Theportions of the furnace element that are downstream of the combustion orburning region for the natural gas are typically exposed to lowertemperatures. As such, portions of the furnace element that are exposedto different temperatures can be formed of different metal layers and/orbrazing materials; however, this is not required. When burning naturalgas, oxygen is generally mixed with the natural gas to facilitate in thecombustion of the natural gas. When the oxygen is added to the furnaceelement, the oxygen can be mixed with the natural gas prior to being fedinto the furnace element and/or inserted into an oxygen port in thefurnace element. In such an arrangement, natural gas is fed into a gasport and the mixes with the oxygen fed into the oxygen port. Typicallyoxygen is fed into the furnace element inserting air into the oxygenport; however, this is not required. The furnace element can include oneor more valves to control the flow of natural gas and/or oxygen into thefurnace element; however, this is not required. The furnace element caninclude one or more temperature monitoring devices to monitor thetemperature in one or more regions of the furnace element; however, thisis not required. The size, length, shape and/or number of passageways inthe furnace element can be selected to control the rate of combustion ofthe natural gas and/or the amount of heat generation and/or heattransfer in one or more portions of the furnace element. A vacuum can beapplied to one or more portions of the furnace element to facilitate indrawing oxygen, natural gas and/or by products of the combustion of thenatural gas through one or more portions of the furnace element;however, this is not required. A sulfur removing arrangement (e.g.,sulfur/sulfur compound scrubber, nitrogen compound scrubber, etc.) canbe used to remove sulfur and/or sulfur compounds from the natural gasand/or combustion components from the combustion of the natural gas;however, this is not required. The furnace element can include one ormore catalysts and/or compounds to facilitate in the combustion of thenatural gas and/or formation and/or removal of combustion componentsfrom the combustion of the natural gas; however, this is not required.

In still yet another and/or alternative non-limiting aspect of thepresent invention, the processing apparatus can be used to form methanolfrom the reacting of carbon dioxide with water. One or more catalystsare typically used to facilitate in the reacting of carbon dioxide withwater. Such catalysts can include, but are not limited to,chromium-aluminum, copper, copper-chromium, molybdenum, nickel,palladium, platinum, silver, vanadium, etc. As can be appreciated, otheror additional metal catalysts can be used. The process for formingmethanol is non-limiting. Two types of methanol reactions that can beformed by the processing apparatus of the present invention areillustrated and described in U.S. Pat. Nos. 3,959,094 5,492,777 and5,599,638, all of which are incorporated herein by reference.

One non-limiting object of the present invention is processing apparatusand a manufacturing process for the processing apparatus or one or moreportions of the processing apparatus that involves the formation of atleast a portion of the processing apparatus by a plurality of metallayers.

Another and/or alternative non-limiting object of the present inventionis a manufacturing process for a processing apparatus or one or moreportions of a processing apparatus that can be at least partially formedby the use of computer generated images and lithographic techniques.

Still another and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that includes the connectingof metal layers to form the processing apparatus or one or more portionsof the processing apparatus.

Yet another and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that includes brazing toconnect together one or more metal layers of a processing apparatus orone or more portions of a processing apparatus.

Still yet another and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that includes a lithographictechnique to form distinct shapes in one or more metal layers that arerepresentative of one or more sections of the processing apparatus orone or more portions of the processing apparatus.

A further and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that utilizes alignmentstructures and construction structures to properly align a plurality ofmetal layers to facilitate in the proper formation of the processingapparatus or one or more portions of the processing apparatus.

Still a further and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that includes at least onemetal coating on one or more sides of one or more metal layers for usein brazing one or more metal layers together to form the processingapparatus or one or more portions of the processing apparatus.

Yet a further and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of the processing apparatus that can form theprocessing apparatus or one or more portions of the processing apparatusin many desired simple and/or complex shapes.

Still yet a further and/or alternative non-limiting object of thepresent invention is a processing apparatus that enables one or moreportions and/or sections of the processing apparatus to be easilyconnected together and/or disconnected from one another.

Another and/or alternative non-limiting object of the present inventionis a processing apparatus that enables simplified catalyst recovery fromthe processing apparatus.

Still another and/or alternative non-limiting object of the presentinvention is a processing apparatus that enables multiple catalysts tobe used and enables the multiple catalysts to be easily separated forseparate recovery processes.

Yet another and/or alternative non-limiting object of the presentinvention is a manufacturing process for a processing apparatus or oneor more portions of a processing apparatus that allows for easierscalability of the processing apparatus from laboratory settings toindustrial settings.

Still yet another and/or alternative non-limiting object of the presentinvention is a processing apparatus that can be designed withstand alarge range of pressures and temperatures.

A further and/or alternative non-limiting object of the presentinvention is a processing apparatus that can have a modular design.

Still a further and/or alternative non-limiting object of the presentinvention is a processing apparatus has a modular design and hasstandardized components that can be used in forming a variety ofdifferent processing apparatus.

Yet a further and or alternative non-limiting object of the presentinvention is a processing apparatus that has a high surface area tostrength ratio.

These and other objects and advantages will become apparent from thediscussion of the distinction between the invention and the prior artand when considering the preferred non-limiting embodiment as shown inthe accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing objects, and others, will in part be obvious and in partpointed out more fully hereinafter in conjunction with the writtendescription of preferred non-limiting embodiments of the inventionillustrated in the accompanying drawings in which:

FIG. 1 is an elevation view of one non-limiting processing apparatus ofthe present invention connected between two pipes;

FIG. 2A is a cross-sectional view along lines 2A-2A of FIG. 1;

FIG. 2B is a cross-sectional view along lines 2B-2B of FIG. 1;

FIG. 3 is a cross-sectional view of another non-limiting configurationof a processing apparatus of the present invention;

FIG. 4 is a cross-sectional view of a middle portion of a processingapparatus of the present invention;

FIG. 4A is another cross-sectional view of a middle portion of aprocessing apparatus of the present invention showing the use ofalignment structures and construction structures;

FIG. 4B is another cross-sectional view of a middle portion of aprocessing apparatus of the present invention;

FIG. 4C is a sectional view of a middle portion of a processingapparatus of the present invention;

FIG. 5 is an elevation view of another non-limiting arrangement of amiddle portion of a processing apparatus of the present invention;

FIGS. 5A-C illustrate various non-limiting shapes of passageways thatcan be formed in a processing apparatus of the present invention;

FIG. 5D is a cross-section of one non-limiting passageway that can beformed in a processing apparatus of the present invention,

FIG. 5E is a sectional view of one non-limiting passageway that can beformed in a processing apparatus of the present invention that includesa catalyst secured to the inner wall of the passageway;

FIG. 5F is a sectional view of one non-limiting passageway that can beformed in a processing apparatus of the present invention that includesa catalyst positioned in a portion of the passageway;

FIG. 6 is a flow chart illustrating a non-limiting method of forming oneor more portions of a processing apparatus of the present invention;

FIG. 7 is a graphical illustration of a plurality of processingapparatuses of the present invention positioned in series in a chemicalprocess;

FIG. 8 is a flow chart illustrating a non-limiting method of recoveringmetal catalyst from the middle portion of a processing apparatus of thepresent invention;

FIG. 9 is an elevation view of a non-limiting processing apparatus ofthe present invention in the form of a furnace element;

FIG. 10 is a cross-sectional view of the processing apparatusillustrated in FIG. 9;

FIG. 11 is a cross-sectional view along line 11-11 of FIG. 10;

FIG. 12 is a cross-sectional view of another non-limiting processingapparatus of the present invention in the form of a furnace element;

FIG. 13 is a cross-sectional view of still another non-limitingprocessing apparatus of the present invention in the form of a furnaceelement;

FIG. 14 is a cross-sectional view of yet another non-limiting processingapparatus of the present invention in the form of a furnace element;

FIG. 15 is a cross-sectional view of another non-limiting processingapparatus of the present invention in the form of a furnace element;

FIG. 16 is a cross-sectional view of still another non-limitingprocessing apparatus of the present invention in the form of a furnaceelement;

FIG. 17 is an elevation view of one non-limiting processing apparatus ofthe present invention that can be used as a micro-reactor;

FIG. 18 is a cross-sectional view of the processing apparatus asillustrated in FIG. 17;

FIG. 19 is a cross-sectional view along line 19-19 of FIG. 18;

FIG. 20 is an exploded view of a portion of the processing apparatus asillustrated in FIG. 17;

FIG. 21 is a cross-sectional view of still another non-limitingprocessing apparatus of the present invention in the form of a furnaceelement;

FIG. 22 is an exploded view of a portion of the processing apparatus asillustrated in FIG. 21; and,

FIGS. 23-25 are elevation view of three non-limiting fluid mixingelements.

DETAILED DESCRIPTION OF NON-LIMITING EMBODIMENTS

Referring now in greater detail to the drawings, wherein the showingsare for the purpose of illustrating non-limiting embodiments of theinvention only and not for the purpose of limiting the invention, FIG. 1illustrates one non-limiting processing apparatus 10 in accordance withthe present invention. The processing apparatus 10 is illustrated asbeing connected between two pipes 20, 22. As can be appreciated, morethan two pipes can be connected to processing apparatus 10. The arrowsillustrate that one or more materials enter the processing apparatusfrom pipe 20 and exit the processing apparatus by pipe 22. Processingapparatus 10 includes two connection extensions 12, 14 that areconnected to pipes 20, 22 respectively by connectors 30, 32. Connectors30, 32 can be any type of connector (e.g., connection sleeve, threadedpipe end, quick connector, etc.). As can be appreciated, pipe 20 and/orpipe 22 can be directly connected to the body of the processingapparatus.

The processing apparatus is illustrated as having a generallyrectangular cross-sectional shape; however, the processing apparatus canhave many of other shapes such as, but not limited to, square, oval,circular, etc. The processing apparatus is also illustrated as having agenerally uniform cross-sectional shape; however, the cross-sectionalshape can be non-uniform along the longitudinal and/or lateral length ofthe processing apparatus. When the processing apparatus is in the formof a micro-reactor, the micro-reactor has total volume that is generallyless than about 1000 cubic inches, typically less than about 500 cubicinches, more typically less than about 200 cubic inches, and even moretypically less than about 100 cubic inches; however, other sizes of themicro-reactor can be formed. When the processing apparatus is in theform of a furnace element, which is a subset of a reactor ormicro-reactor of the present invention, for use in a residentialfurnace, the furnace element has total volume that is generally lessthan about 2000 cubic inches, typically less than about 1500 cubicinches, and more typically less than about 1000 cubic inches; however,other sizes of the furnace element can be formed.

When the processing apparatus is formed as a micro-reactor, themicro-reactor can be designed such that one or more reactants (e.g.,gas, liquid, solid particles, etc.) that are to be processed areintroduced or flowed into the inlet of the micro-rector. The reactantsin the micro-reactor can be subjected to desired temperatures,pressures, flow rates and/or catalysts to achieve the desired chemicalreaction. One or more channels or passageways through the micro-reactorcan be formed to obtained the desired mixing rates, flow rates, heatexchange, and/or catalytic reactions of one or more of the reactants inthe micro-reactor. After the reacted chemicals have passed through themicro-reactor, the reacted chemicals exit the outlet port of themicro-reactor and proceed to further processing or packaging. Themicro-reactor is particularly directed to the specialty chemicalindustry which includes pharmaceuticals; however, the micro-reactor canbe used to manufacture non-specialty chemicals. The processing apparatusof the present invention when in the form of a micro-reactor has thefollowing advantages over prior art reactors, namely 1) ability tocreate intricate passageways in the micro-reactor, 2) has enhanced heattransfer capabilities, 3) ease of scale via adding additionalmicro-reactors on-line instead of past scale-up process, 4) ability towithstand high temperatures and/or pressures, is so desired, 5) abilityto immobilize catalysts so as to minimize diffusional mass transferresistances and/or pressure drop, 6) ease of manufacture, 7) ease ofduplication, and/or 8) the ability to stack various modules or portionsof the micro-reactor together. As can be appreciated, other advantagesmay exist by using the micro-reactor.

When the processing apparatus is formed as a heat exchanger, the heatexchanger can be designed such that one or more materials (e.g. gas,liquid, etc.) are flowed into the inlet of the heat exchanger. Thematerials in the heat exchanger can then be subjected to desiredtemperatures, pressures, and/or flow rates to achieved the desired aboutof heat exchange with the walls of the heat exchanger and/or one or moreother materials flowing in and/or about the heat exchanger. One or morechannels or passageways through the heat exchanger can be formed toobtained the desired mixing rates, flow rates, and/or heat exchange ofone or more of the material in the heat exchanger. After the materialshave passed through the heat exchanger, the materials exit the outletport of the heat exchanger.

The processing apparatus can be formed such that the processingapparatus has functioned both as a reactor and a heat exchanger. Forexample, the processing apparatus can be a furnace element that isdesigned to burn a gas and then transfer the generated heat to airand/or liquid in and/or about the furnace element. As can beappreciated, the processing apparatus can be formed in many other typesof devices.

Referring again to FIG. 1, the top portion 40 of processing apparatus 10is shown to include connection extension 12, and the bottom portion 50is shown to include connection extension 14. When the processingapparatus is to be used in high pressure and/or high temperatureapplications, the top and bottom portions of the processing apparatusare typically made of a durable material. Non-limiting examples of suchdurable materials include, but are not limited to, ceramic, stainlesssteel, nickel alloy, titanium alloy, etc. The top and bottom portion ofthe processing apparatus are also typically made of the same material;however, this is not required. As illustrated in FIGS. 2A and 2B, thetop portion and bottom portion include a cavity 42, 52 respectivelywhich is designed and sized to receive and encapsulate a middle portion60 when the top and bottom portions are positioned together. As can beappreciated, the top and/or bottom portions can be designed without acavity. As can also be appreciated, the processing apparatus may onlyinclude the middle portion, or the middle portion and the top or bottomportion.

Referring now to FIG. 3, another non-limiting configuration of theprocessing apparatus is shown. The top and bottom portions of theprocessing apparatus do not include a cavity? thus do not encapsulatethe middle portion between the top and bottom portions. As can beappreciated, the top or bottom portion can be designed with a cavitythat can be substantially fully receive the middle portion and the otherportion is merely designed to cover the bottom of the cavity toencapsulate the middle portion between the top and bottom portion. Ascan further be appreciated, many other configurations for the top andbottom portions can be used to partially or fully encapsulate the middleportion of the processing apparatus.

Referring again to FIGS. 1, 2A and 2B, a securing flange 44, 45 ispositioned at the base of each cavity of the top and bottom portions. Ascan be appreciated, the top and/or bottom portions of the processingapparatus can be designed without a flange. The securing flanges, whenused, are used to help secure the top and bottom portions of theprocessing apparatus together. As can be appreciated, one or moreclamps, bolting arrangements, locks, rivets, etc. can be used inconjunction with the flanges to secure the top and bottom portions ofthe processing apparatus together. The flanges can also and/oralternatively be connected together by welding, soldering or brazingmetal. As shown in FIGS. 1, 2A and 2B, the flanges are connectedtogether by a brazing metal 80 which will be discussed in more detailbelow.

As shown in FIGS. 1, 2A and 2B, the top and bottom portions of theprocessing apparatus are typically designed to at least partially encasethe middle portion 60 to provide protection to the middle portion. Thiscan be an especially advantageous arrangement when the middle portion isexposed to high temperatures, exposed to high pressures, contains and/oris at least partially formed of a catalyst material, and/or containsand/or is at least partially formed of a valuable catalyst material. Forexample, the middle portion may contain and/or be at least partiallyformed of a valuable catalyst material (i.e., a precious material) thatneeds to be secured. Such encapsulation by the top and bottom portionscan be used to at least partially provide such secure environment. Inanother and/or alternative example, the middle portion may containand/or be at least partially formed of a catalyst material that isadversely affected by atmospheric conditions (e.g., water, oxygen,nitrogen, carbon dioxide, etc.). The encasing provided by the top andbottom portions provides protection to the middle portion. If the middleportion need not be protected and/or supported by the top and/or bottomportions, the middle portion can be exposed as illustrated in FIG. 3.

As illustrated in FIGS. 2A, 2B and 3, the top and bottom portion caninclude one or more passageways to direct material into and/or receivematerials from the middle portion. As illustrated in FIGS. 2A and 2B,the top portion 40 includes a single passageway 46 and the uppersurface. The bottom portion 50 also includes a single passageway 56.Passageway 46 directs material into a passageway 62 in the middleportion which divides into two passageways 64, 66 and then reforms atthe base of the middle portion into a single passageway 68. Thematerials are then directed into passageway 56 to direct the materialsout of the processing apparatus. As illustrated in FIG. 3, the top andbottom portions can have a plurality of passageways; however, this isnot required. Connection extension 12 is illustrated as feeding materialinto the single passageway 46 in top portion 40. Passageway 46 thensplits into four passageways 46 a, 46 b, 46 c and 46 d. The fourpassageways then direct the material into four passageways 64′, 66′,68′, and 70′ in middle portion 60. After the material has passed throughthe middle portion, the material flows into passageways 68 a, 68 b, 68c, and 68 d in bottom portion 50 and then merges into single passageway68 near the base of the bottom portion. As can be appreciated, manyother passageway configurations can be utilized in the processingapparatus.

As illustrated in FIGS. 2A, 2B and 3, the passageways through theportions of the processing apparatus can take on many different shapes.The passageways can be tubular, but this is not required. In FIG. 3, thepassageways have a generally uniform cross-sectional shape and size;however, this is not required. The length and route through the middleportion of each of the passageways is shown to be different; however,this is not required. In FIGS. 2A and 2B, the passageways do notmaintain a uniform cross-section shape and size; however, this is notrequired. The route through the middle portion of each of thepassageways is shown to be different; however, this is not required. Ascan be appreciated, one or more of the passageways can have the sameshape, length and/or size. As can also be appreciated, the passagewayscan all have different shapes, lengths and/or sizes. The size, shapeand/or length of one or more passageways in the top, bottom and/ormiddle portions of the processing apparatus can be selected to achievecertain flow rates, material resident times, pressure profiles,temperature profiles, catalyst exposure times, mixing profiles, heatexchange times, etc.

Referring now to FIGS. 4, 4A, 4B, 4C and 55 the construction of aportion of the processing apparatus is illustrated. The portionillustrated is the middle portion: however, other portions of theprocessing apparatus can be formed in a similar manner; however, this isnot required. For instance, one or more portions of the processingapparatus can be at least partially a molded, machined and/or castcomponent. As also can be appreciated, the middle portion can be formedonly partially by the construction illustrated in FIGS. 4, 4A, 4B, 4Cand 5. Referring now to FIGS. 4 and 5, the middle portion can be atleast partially formed of a plurality of metal layers 72 that areconnected together by a laminating agent 74 (e.g., brazing metal,adhesive, etc.). The metal layers are illustrated as being the samethickness; however, this is not required. The laminating agent is alsoillustrated as having the same thickness; however, this is not required.The metal layers are illustrated as having a generally rectangularshape; however, it can be appreciated that one or more metal layers canhave a different shape and/or size from one another and/or have a shapethat is different from a rectangular shape. The middle portion isillustrated as including two passageways 64, 66; however, it can beappreciated that only one passageway or more than two passageways canexist in the middle portion and/or other portions of the processingapparatus. For examples, FIG. 4B illustrates a processing apparatus thatincludes two middle portions 60 a and 60 b that include more than twopassageways on the middle portions. The two passageways in the middleportions are illustrated in FIG. 4 as spiraling through the middleportion; however, it can be appreciated that one or more passageways canbe straight or have any other desired shape. As illustrated in FIGS. 4Band 4C, one or more passageways have a different shape from thepassageways in FIG. 4. The two passageways are illustrated in FIG. 4 ashaving a generally constant cross-section shape and size along thelength of the passageways; however, it will be appreciated that thecross-section shape and size along the length of one or more passagewayscan vary. As illustrated in FIGS. 4B and 4C, the passageways have adifferent cross-section shape and size along the length of thepassageways. As illustrated in FIGS. 5A-D, various non-limitingcross-sectional shapes of one or more passageways P are illustrated.FIG. 5A illustrates a passageway having a generally cylindrical shape.FIG. 5B illustrates a passageway having a generally wave-shape and alsohaving a non-uniform cross-sectional area along the length of thepassageway, FIGS. 5C and 5D illustrate a passageway having a verycomplex cross-sectional shape. For example, the passageway can have acomplexity that mimics the size and, or distribution of pores of aporous material. As such, particles, catalysts of various shapes,porosity size and/or pore distribution of particles and/or catalyst canbe at least partially mimicked by the complex passageway. The complexityof the passageway shape is non-limiting. It can be appreciated thatpassageway shapes can be formed to simulate material flowing through acatalyst; however, this is not required.

Referring now to FIGS. 5E and 5F, a catalyst is illustrated as beingpositioned in passageway P. As previously mentioned, the one or moremetal layers used to form the one or more passageways in the processingapparatus can be formed of a catalyst material; however, this is notrequired. When the one or more metal layers are used to form at least aportion of one or more passageways, the wall of the passageway canbecome a catalytic surface; however, this is not required. FIGS. 5E and5F illustrate an alternative or additional arrangement to introducecatalyst in one or more portions of one or more passageways. FIG. 5Eillustrates a passageway that includes a catalyst material C that iscoated, plated and/or otherwise bonded to the inside surface of thepassageway. The catalyst material can be a metal material; however, thisis not required. The catalyst material can be formed of a singlematerial or multiple materials. The passageway can have one type ofcatalyst material or multiple types of catalyst material along thelength of the passageway. Referring now to FIG. 5F, the passagewayincludes a catalyst that is placed in one or more portions of thepassageway. This catalyst can be a standard granular catalyst, particlecatalyst, etc. The catalyst can be retained in a certain portion of thepassageway by a barrier B (e.g., wire screen, slotted wall, meshmaterial, etc.); however, this is not required. As can be appreciated,both passageway arrangements as illustrated in FIGS. 5E and 5F can beused, and/or other and/or alternative arrangements can be used to placeone or more catalyst in one or more portions of one or more passageways.

Referring now to FIGS. 4A-C, there are illustrated alignment structures90 and construction structures 92. The alignment structures 90 a, 90 bas illustrated in FIG. 4A are in the form of a pin or bolt,respectively. The alignment structures are designed to be inserted inand/or through slots or openings in the metal layers. These slots oropenings define the construction structures in the metal plates. As canbe appreciated the alignment structure can be formed by structures otherthan a pin. In addition, the construction structures can take a formother than an opening or slot. The alignment structures 90 andconstruction structures 92 are used to orient one or more metal layersrelative to one another in the middle portion and/or some other portionof the processing apparatus. As can be appreciated, one or more of themetal layers are not required to include construction structures. As canalso be appreciated, one or more metal layers can include a differentnumber of construction structures. Alignment structure 90 a is in theform of a pin that traverses the complete thickness of the middleportion. As can be appreciated, the alignment structure need nottraverse the complete thickness of the middle portion and/or any otherportion of the processing apparatus. Alignment structure 90 b isillustrated as including a threaded end 94. This threaded end can beused to secure one end of the alignment structure to a portion of themiddle portion and/or any other portion of the processing apparatus,and/or to secure together one or more metal layers of the middle portionand/or any other portion of the processing apparatus; however, this isnot required. The alignment structure 90 b can also or alternatively beused to at least partially secure together one or more portions of theprocessing apparatus; however, this is not required. As can beappreciated, the threaded end of the alignment structure 90 b can takeon other or additional configurations to enable the end to be at leastpartially secured to and/or connect together one or more metal layers.The alignment structures 90 and construction structures 92 areillustrated as being positioned on the side regions of the metal layers;however, this is not required. The alignment structures 90 andconstruction structures 92 can be positioned in any region of the metallayers.

Referring now to FIG. 4C, one or more portions of the processingapparatus can include a cavity that is designed to receive one or morecomponents; however, this is not required. For example, middle portion60 includes a cavity 96 that is formed in one or more metal layers.Cavity 96 is designed to receive a tube portion 98. The tube portion isinserted into the cavity during the assembly of the processingapparatus. The tube can be formed of a special material, have a specialconfiguration, include one or more catalysts, have a special interiorconfiguration, etc.; however, this is not required. As can beappreciated, the cavity, when used, can have many configurations to atleast partially accept many other types of components.

Referring again to FIG. 4C, the processing apparatus includes two middleportions 60 a and 60 b. As can be appreciated, the processing apparatuscan include more than two middle portions or only one middle portion.The multiple middle portions can be formed of the same or differentmaterials. For instance, one middle portion can include one type ofcatalyst and another middle portion may not include a catalyst orinclude a different catalyst. The multiple middle portions can have thesame or different number of metal layers. The multiple middle layers canhave the same or different size and/or shape.

Referring now to FIG. 6, one non-limiting process for manufacturing themiddle portion and/or other portion of the processing apparatus isillustrated. As can be appreciated, many other manufacturing processescan be used to form one or more portions of the processing apparatus. Asshown in FIG. 6, the first step of the manufacturing process 100 is todetermine the desired shape of the processing apparatus or one or moreportions of the processing apparatus. The drawing of the processingapparatus or one or more portions of the processing apparatus may be amechanically drawn device and/or may be an electronically generateddevice.

Once the desired shape of the processing apparatus or one or moreportions of the processing apparatus is determined, the shape of theprocessing apparatus or one or more portions of the processing apparatusis electronically entered 110, if not already, so as to form athree-dimensional computer-generated image of the processing apparatusor one or more portions of the processing apparatus. As can beappreciated, the complete processing apparatus can be electronicallyentered, or only the portions of the processing apparatus that are to beformed by the process can be electronically entered. For purposes of thefollowing description, the top, bottom and middle portion of theprocessing apparatus are to be formed by this process. One softwarepackage that can be used to generate the three-dimensional computergenerated processing apparatus is AutoCAD. Many other CAD softwareprograms or other types of drawing programs can be used.

After the processing apparatus or one or more portions of the processingapparatus are electronically entered, the drawing is electronicallysectioned or sliced into a plurality of cross-sections 120. The sectionsor slices of the processing apparatus or one or more portions of theprocessing apparatus are generally taken along a single axis (e.g.,longitudinal, vertical, horizontal, etc.); however, this is notrequired. The thickness of each section or slice of the processingapparatus or one or more portions of the processing apparatus isrepresentative of the thickness of the metal layer to be used to formthe processing apparatus or one or more portions of the processingapparatus. The thickness of the metal layer can be a thin metal layer(i.e., metal foil layer) or be a thick layer. When the metal layer isvery thin, many sections or slices of the processing apparatus or one ormore portions of the processing apparatus need to be electronicallygenerated. Each of the sections can include one or more holes or slotsthat will be used to orient the formed metal layers and also be used tomaintain the position of the formed metal layers during heating andcooling of the metal layers; however, this is not required. Typicallythese holes or slots are positioned about the periphery of each sectionor slice of the processing apparatus or one or more portions of theprocessing apparatus; however, the holes or slots can be positioned inother locations. As can be appreciated, it is critical to the inventionof the order of the above steps. For instance, one or more of thesections can be first formed and then one or more section can be formedtogether to create a three dimensional portion of the apparatus. It willalso be appreciated that the one or more sections can be formed in 2and/or 3 dimensional sections. The important step of the process thusdescribed is that multiple sections are formed, either electronically orby accurate mechanical drawings to represent one or more sections of theapparatus.

Once the sections or slices of the processing apparatus or one or moreportions of the processing apparatus are generated, a lithographic maskcan be produced 130 for each metal layer to be used to form theprocessing apparatus or one or more portions of the processingapparatus. Each lithographic mask defines the features of each uniquemetal layer of the processing apparatus or one or more portions of theprocessing apparatus. The process for producing lithographic masks arewell known in the art, thus will not be further described herein.

After the lithographic masks are produced for each metal layer of theprocessing apparatus or one or more portions of the processingapparatus, the metal layers are obtained 140 and one or more sides ofone or more metal layers are coated 145 with a brazing metal; however,this is not required. As can be appreciated, another type of laminatecan be used (e.g., adhesive, etc.). If one or more of the metal layersare to be connected together by an arrangement other than a laminationprocess (e.g., weld, solder mechanical connector, etc.), a laminate maynot be applied to one or more of the metal layers. As can also beappreciated, the laminate coating on one or more metal layers can beapplied to one or more metal layers prior to be at least partiallyprocessed by use of the lithographic masks; however, this is notrequired. The plurality of metal layers that are used to form theprocessing apparatus or one or more portions of the processing apparatuscan be any type of metal. When forming the top and bottom portions ofthe processing apparatus, the metal layers, when used to form suchportions, are typically made of a durable metal such as, but not limitedto, stainless steel, nickel alloy, titanium alloy, etc.; however, thisis not required. When forming one or more middle portions of theprocessing apparatus, a special metal may be used, such as a metal thatcatalyzes and/or facilitates in catalyzing a chemical reaction; however,this is not required. Many types of these special metals can be usedsuch as, but not limited to, aluminum, cobalt, copper, gold, iridium,lithium, molybdenum, nickel, platinum, palladium, rhodium, rutheniumand/or silver, etc. As can be appreciated, the middle portion can beformed of the same type of metal layer or be formed of two or moredifferent metal layers. For instance, half of the metal layers can beformed from gold and half of the metal layers can be formed fromplatinum. Many other or additional combinations can be used to enablematerials passing through the processing apparatus to be exposed to oneor more metals that catalyze and/or facilitate in catalyzing a chemicalreaction as the materials pass through the processing apparatus or oneor more portions of the processing apparatus. As can be appreciated,when the processing apparatus is not to be used as a reactor, none ofthe metal layers have to be formed of special metals; however, this isnot required. As can also be appreciated, the top and/or bottom portionof the processing apparatus can be made of the same or similar materialsas the one or more middle portions; however, this is not required. Ascan further be appreciated, the top and/or bottom portion of theprocessing apparatus can be formed of a single metal layer or aplurality of the same or different metal layers. As previouslymentioned, the thickness of the metal layers used in the presentinvention can vary. When thin metal layers are used, the thickness isgenerally about 40-150 microns. As can be appreciated, other metal layerthicknesses can be used. The metal layer can be coated on one or bothsides by a brazing metal or other type of laminate; however, this is notrequired. The coating of the brazing metal on the one or more metallayers when used, is typically by an electroplating process; however,other coating processes can be used. The coating thickness of thebrazing metal is generally about 0.1-10 microns, and typically about0.2-1.5 microns; however, other thicknesses can be used. The brazingmetal can be any type of brazing material that can be used tosuccessfully secure two adjacent positioned metal layers together andprovide the desired connection strength. The brazing material for allthe metal layers can be the same or can be different.

Once the coated metal layer is obtained, the metal layer can besubjected to lithographic micro-machining techniques and/ormicro-machining techniques 150 to produce patterned metal layers thatare ultimately used to form the processing apparatus or one or moreportions of the processing apparatus. Some of the micro-machiningtechniques that can be used include photo-etching and reactive ionetching. This step is optional when one or more metal layers are formedby techniques other than lithographic techniques.

When thin metal layers are not used to form the apparatus, or one ormore portions of the apparatus are not formed by thin metal layers, oneor more other techniques can be used to form one or more of the metallayers; however, this is not required. Such other techniques include,but are not limited to, metal stamping, drilling, casting, ultrasoniccutting, water cutting, pressure forming, etching, laser cutting, borecutting, etc. After the one or more metal layers are formed by this oneor more other processes, a brazing metal, as described above, can beapplied to such one or more metal layers; however, this is not required.

After the metal layers have been formed, the metal layers are alignedand stacked 160 to form the desired three-dimensional shape of theprocessing apparatus or one or more portions of the processingapparatus. The metal layers should be stacked so that a brazing metaland/or other type of laminate exist between each metal layer that is tobe connected together by a laminate. This arrangement can be achieved ina number of different ways. One non-limiting way is to have one side ofeach of the metal layers to be coated with the brazing metal. Thealignment of the metal layers can also be accomplished in a variety ofways. Typically, alignment pins or other fixed structures are used toalign the multiple layers of metal layers; however, this is notrequired. The holes or slots in the metal layers are inserted onto thealignment pins thereby properly orienting the metal layers with respectto one another.

The aligned and stacked metal layers are then connected together asshown in step 170. Many processes can be used to secure two or metallayers together (e.g., lamination process, mechanical connections,welding, soldering, etc.). When a brazing process is used, a pluralityof metal layers are subjected to heat so as to braze together the metallayers. Additionally or alternatively, pressure can be applied to aplurality of metal layers when securing together the plurality of metallayers by a lamination process and/or some other process. When using abrazing process, the heating of the coated metal layers at a properelevated temperature for a sufficient time will result in the metalcoating to soften and/or melt and flow between the metal layers.Typically, the brazing process is conducted under a vacuum; however,this is not required. The heating of the metal layers during a brazingprocess typically occurs in an inert atmosphere; however, this is notrequired. During the heating process, the metal layers expand. Thealignment holes or slots can be used to maintain the metal layers inalignment during this heating process. Typically the alignment holes orslots in the metal layers can be sized and shaped to account for theexpansion of the metal layers during heating; however, this is notrequire. In such an arrangement, when the metal layers are heated at ornear their maximum temperature, wherein the brazing material ispartially or fully liquified, the holes or slots line up relative to thealignment pins so as to form the desired shaped of the processingapparatus or one or more portions of the processing apparatus.

Once the metal layers are heated for a sufficient time, the formedprocessing apparatus or one or more portions of the processing apparatuscan be cool as illustrated in step 180. This step can be skipped whenthere is no heating of the metal layers. When the metal layers areheated and then cooled during a brazing process, the brazing materialsolidifies thereby locking the metal layers in position relative to oneanother. The alignment holes or slots in the metal layers, when used,can be sized and shaped so as to allow the locked together metal layersto contract during cooling; however, this is not required. Typically,the cooling occurs in an inert atmosphere; however, this is notrequired. The use of the above method to manufacture a processingapparatus or one or more portions of the processing apparatus can resultin a cost-effective process to manufacture a processing apparatus or oneor more portions of the processing apparatus that has a specific designfor use in a particular process.

As previous described, FIGS. 4 and 5 illustrate a section of a middleportion of a processing apparatus that can be formed by the processdescribed in FIG. 6. Middle portion 60 includes a plurality of metallayers 72 that are connected together by a laminate 74 such as a brazingmetal or adhesive.

The following example illustrates the manufacture of the middle portionof a processing apparatus or one or more portions of the processingapparatus that is formed of platinum in accordance with the presentinvention. The manufacturing process of the present invention canprovide methods for fabricating a processing apparatus or one or moreportions of the processing apparatus having three-dimensional passagewayconfigurations that are difficult, if not impossible to make byconventional manufacturing processes.

The first part of the manufacturing process involves the generation of athree-dimensional computer model of the middle portion of the processingapparatus. The computer-generated model of the middle portion is dividedinto a plurality of sections that are cut parallel to the longitudinalaxis of the middle portion. The thickness of the sections issubstantially uniform and reflects the thickness of the metal layer tobe used to make the middle portion. Guide holes or slots are alsoinserted for each section. The number, size and shape of the guide holesor slots are selected to achieve the proper orientation of the metallayers during the heating and cooling of the metal layers.

In one non-limiting example, the metal layers used to form the middleportion include thin metal platinum layers having a thickness of about30-150 microns. These thin metal layers are coated on at least one sidewith a thin metal electroplated layer of a brazing metal having athickness of about 0.1-10 microns. Non-limiting examples of brazingmetals for the metal coating include nickel-silver alloys. A specificexample of a coated metal layer for use in manufacturing the middleportion of the processing apparatus is a platinum metal layer coated onone side with an electroplated nickel-silver alloy coating wherein thethickness of the platinum metal layer is about 77 microns, the thicknessof the nickel-silver alloy coating is about 1 micron and the totalthickness of the coated thin metal layer is about 78 microns. In thisexample, the sliced sections of the computer generated middle portion ofthe processing apparatus would represent sections having a thickness ofabout 78 microns. The middle portion would thus be formed from about100-3000 coated thin metal layers.

Each of the coated thin metal layers can be then chemically etched tomatch a specific section of a computer generated section of the middleportion. Photo-masks can be produced for etching each of the metallayers. Each metal layer can be processed using standard photo-etchingtechniques and can be etched in such a way that the cross-sectionalshape of the etched walls for each metal layer is perpendicular to thetop and bottom surfaces of the metal layer (commonly referred to asstraight sidewalls).

Once all the metal layers are etched, the metal layers can be stackedtogether in order to form the complete middle portion or a portion ofthe middle portion. The guide holes or slots in the tin metal layers canbe used to orient the thin metal layers on guide pins, such as, but notlimited to, graphite pins. The thin metal layers can be coated such thata nickel-silver brazing metal coating existed between each metal layer.The stacked thin metal layers can then be bonded together by a vacuumbrazing process; however, this is not required. During the brazingprocess, the layered assembly can be heated in an inert and/oroxygen-free atmosphere to a temperature of 100-1300° C. for about 20-75minutes, which can cause the coated nickel-silver alloy coating to flowthereby wetting the surfaces of the platinum thin metal layers. Thetemperature and time of heating should be selected to allow thenickel-silver brazing metal to generally uniformly flow and connect thethin metal layers of platinum together at substantially all the contactpoints. The brazed layers of platinum thin metal layers can be thencooled in an inert atmosphere for about 1-3 hours and then removed. Theformed middle portion can then be removed from the guide pins and theninspected for quality control purposes to determine if the formed middleportion has been properly formed in accordance with the desiredspecifications.

Referring now to FIG. 7, there is illustrated a plurality of processingapparatuses 10 connected between pipes 20 and 22. FIG. 7 illustratesthat the number of processing apparatuses used in a process can beeasily increased or decreased depending on the desired conditions. Forinstance, when the processing apparatus is in the form ofmicro-reactors, the number of micro-reactors used in a particularchemical process can be easily increased or decreased depending onpresent production rates of a chemical compound. In addition one or moreof the micro-reactors can be taken out of service without having to shutdown the chemical process. For example if a line to one of themicro-reactors becomes clogged or the catalyst in one micro-reactorbecomes fouled or spent, the pipeline feeding the particularmicro-reactor could be shut off and the micro-reactor could then bereplaced or pipes feeding the micro-reactor could be serviced withouthaving to shut down the complete chemical process. As such, one of themicro-reactors can be taken out of service, and/or one or more ofmicro-reactors 10′ can be placed in service so that little or nointerruption of the chemical process occurs. In prior reactor systems,wherein a single large reactor was used, the chemical process wastypically terminated so that the reactor could be serviced (e.g.,cleaned, replace catalyst, etc.). The use of the micro-reactors of thepresent invention can be used to enable a chemical process to continuewithout having to shut down one or more micro-reactors when in need ofservice. As can be appreciated, this same concept can be used for aprocessing apparatus in a form other than a micro-reactor.

Referring now to FIG. 8, there is illustrated a flow chart for onenon-limiting process of recovering a catalyst in one or more portions ofthe processing apparatus, when a catalyst is used in the processingapparatus. When the processing apparatus is formed of a top portion, abottom portion and one or more middle portions, the one or more middleportions can include a catalyst. In many types of chemical reactions,the catalyst may be a precious metal that is highly desirable torecover. Consequently, once the catalyst is spent or fouled, pastreactors that included the valuable catalyst were generally sent to arecovery facility to recover the precious metal of the catalyst.Typically, the whole prior art reactor was melted down and the preciousmetal was then separated by expensive and time consuming techniques.Other prior art recovery techniques included exposing the prior artreactor to high energy plasma to melt the prior art reactor and/orcatalyst support to thereby recover the catalyst. This process is alsotime consuming and expensive. The processing apparatus of the presentinvention can be designed to overcome the past difficulties and the highcosts associated with valuable catalyst recovery. Referring now to FIG.8, the first step 200 is to remove the processing apparatus from achemical process line. Once the processing apparatus is removed from theprocess line, the processing apparatus is disassembled. As illustratedin FIGS. 1, 2A and 2B, the top and bottom portions of the processingapparatus can be secured together at flanges 44, 54 by a brazing metal80 and/or by other or additional arrangement. In practice, when abrazing metal is used, the melting point of the brazing metal is lessthan the melting point of the brazing metal that secures together themetal layers of the middle portion, and the top portion and bottomportions if one or both of these portions are formed from metal layers.By selecting a brazing metal having this lower melting temperature, theprocessing apparatus can be heated to or slightly above the meltingpoint of brazing metal 80 to enable the top and bottom portions to beseparated from one another without causing any of the metal layers ofthe middle portion, top portion and/or bottom portion to separate. Thisis step 210 as shown in FIG. 8. If the top and bottom portions of theprocessing apparatus are mechanically connected together, this heatingstep can be ignored.

As shown in FIG. 3, the middle portion of the processing apparatus isconnected to the top portion by a laminate 82, such as a brazing metal,and to the bottom portion by laminate 84, such as a brazing metal. Themiddle portion can be connected to the top and/or bottom portion by alaminate such as brazing metal; however, this is not required. Forinstance, the middle portion can be encapsulated between the top andbottom portion as shown in FIGS. 1, 2A and 2B without having to beconnected to the top and/or bottom portions. When the middle portion isconnected to the top and/or bottom portion as illustrated ion FIG. 3,the melting point of brazing metal 82 and 84, when used, is less thanthe melting point of the brazing metal that secures together the metallayers of the middle portion, and the top portion and bottom portions.The lower melting temperature of the brazing metal layers 82 and 84allow the processing apparatus to be heated to or slightly above themelting point of brazing metal 82 and 84 to enable the top and bottomportions to be separated from one another without causing any of themetal layers of the middle portion, top portion or bottom portion to beseparated. This step is again illustrated as step 210 of FIG. 8.

Once the middle portion of the processing apparatus is separated fromthe top and bottom portions of the processing apparatus, the metal inthe one or more separated portions can be simply recovered by meltingthe individual portions as represented in step 230.

When the middle portion of one or more of the other portions of themicro-reactor are formed from thin metal layers of different metals, thedifferent thin metal layers can be separated prior to the melting andrecovery step 230; however, this is not required. This separation stepis illustrated as step 220 of FIG. 8. For example if the middle portionis formed of two catalyst metals such as gold and platinum, the gold andplatinum layers can be separated from one another prior to melting themetal layers. This separation can be accomplished by selecting a brazingmetal that melts at a certain temperature. If, for example, the middleportion was formed of 1000 metal layers and metal layers 1-400 wereformed of gold and metal layers 410-1000 were made of platinum, thebrazing metal between layers 400 and 401 could be selected to have alower melting point than the brazing metal used to connect togetherlayers 1-400 and layers 401-1000. As such, the middle portion could beheated to the melting point or slightly above the melting point of thebrazing metal between metal layers 400 and 401 so as to soften or meltthis brazing metal without causing the brazing metal between metallayers 1-400 and 401-1000 to melt. Consequently, metal layers 1-400 and401-1000 could be then separated from one another and then subsequentlymelted in separated facilities in accordance with step 230. As can beappreciated, the brazing metals selected to connect one or more portionsof the processing apparatus together, and/or one or more metal layerstogether can be used to control the separation of various sections ofthe processing apparatus in an orderly manner to form and/or disassemblethe processing apparatus as desired.

Referring now to FIGS. 9-22, there is illustrated another non-limitingembodiment of the processing apparatus in the form of a furnace element300. As can be appreciated, the processing apparatus illustrated inFIGS. 9-22 can be used for other purposes. As illustrated in FIGS. 9-11,furnace element 300 is formed of two metal layers 302, 304 that arelaminated together by a laminate 310. The lamination can be in the formof a high temperature adhesive (RTU silicon adhesive, ceramic adhesives,epoxy adhesives, polyimide adhesives, etc.). As used herein, hightemperature means a temperature of at least about 100° C. As such, ahigh temperature adhesive is an adhesive that can maintain a bond attemperatures at least as high as about 100° C. As can be appreciated,when the processing apparatus is used in applications that do notinvolve high temperatures, other types of adhesives can be used. Thelamination can also or alternatively be in the form of a brazing metal.The type of brazing metal used generally depends on the composition ofmetal layers 302, 304 and the temperature of operation of the furnaceelement. Non-limiting examples of brazing metals include, but notlimited to, silver, silver-brass, silver-tin, silver-nickel lead-tin,nickel-brass, or nickel. The metal layers can be formed of the same ordifferent material. For furnace applications, materials such as aluminumand copper have a high heat transfer rate, thus are ideal metals forsuch applications; however, such metals can be costly, thus notcommercially viable in various applications. As such, less costly metalssuch as carbon steel or stainless steel can be used. As can beappreciated, other metals can also be used for one or more of the metallayers. The thickness of the metal layers can depend in part on 1) thenumber of metal layers used to form the furnace element and 2) the sizeand design of the furnace element. As illustrated in FIGS. 9-11, thefurnace element is formed of two metal layers 302, 304. For the furnaceelement illustrated in FIGS. 9-11, the furnace element is for home useand has a volume of less than about 1200 cubic inches. As can beappreciated, larger or smaller furnace elements can be used. As also canbe appreciated, the furnace element can be other sizes for non-home use(e.g., commercial use, etc.). For the furnace element for home use thathas a volume of less than about 1200 cubic inches, the average thicknessof the furnace element is about 0.2-5 inches (5080-127,000 microns), andgenerally about 0.4-2 inches (10,160-50,800 microns); however, otheraverage thicknesses can be used. The metal layers are illustrated ashaving generally the same thickness; however, this is not required. Theaverage thickness of metal layers 302, 304 is about 0.1-3 inches(2540-76,200 microns), typically about 0.2-1.5 inches (5080-38,100microns), and even more typically about 0.25-0.75 inch (6350-19,050microns). As can be appreciated, many other thickness can be used formetal layers 302 and/or 304. As can be appreciated, if the furnaceelement is formed from thin metal layers, then the average thickness ofthe metal layers will typically be less and the number of metal layersused to form the furnace element will typically be greater. In addition,if thin metal layers are used, metal layers 304 and/or 302 may be formedof a plurality of thin metal layers that have been laminated together;however, this is not required. The metal layers are illustrated ashaving a shape of a generally rectangular prism; however, it can beappreciated that one or both of the metal layers can have other shapes.

As best shown in FIG. 10, a single passageway 320 serpentines throughthe middle of the furnace element. As can be appreciated, more than onepassageway can exist in the furnace element. As also can be appreciated,passageway paths other than or in addition to a serpentine passagewaycan be used. If the furnace element includes two or more passageways,the passageways can have the same or different shaped pathways.Passageway 320 is illustrated as having a generally circularcross-sectional shape as illustrated in FIG. 11; however, it can beappreciated that other or additional cross-sectional shapes (e.g.,polygonal, oval, etc.) can be used in one or more portions of thepassageway. Passageway 320 is illustrated as having a generally constantcross-sectional size and shape along the length of the passageway;however, this is not required. For example, when one or more materialspassing through the passageway increase or decrease in volume and/orpressure, the cross-sectional area of the passageway one or more regionsof the passageway can be adjusted to accommodate for such volume change.In one specific example, natural gas and air can be directed intopassageway 320 and be combusted to create heat. The combustion of thegasses in the passageway in combination with the increase in gastemperature causes pressure increases in the combustion region. If thecross-sectional area of the passageway is too small, a gas back-flow inthe passageway may occur, thereby resulting in the improper operation ofthe furnace element. In addition or alternatively, it thecross-sectional area in the passageway is too small or to large, theproper and/or most efficient combustion of the gasses may not occur. Asthe gas temperature decreases downstream from the combustion region, thegas pressure may drop due to the decrease in the volume of the gas at alower temperature. As such, the furnace element can be designed suchthat the cross-sectional area of the one or more passageways in thecombustion region is larger than other portions of the one or morepassageways; however, this is not required.

As illustrated in FIGS. 9 and 10, the furnace element 300 includes threeports 330, 332, 334 that are in fluid communication with passageway 320.Gas port 330 can be used to connect to a natural gas source and gas port332 can be designed to connect to an air or oxygen source, or viceversa. Gas port 334 can be used to connect to an exhaust pipe to conveythe combusted gasses from the furnace element. One or more of the portscan include connection arrangements to facilitate in connecting a pipe,tube, etc. to one or more of the ports; however, this is not required.As can also be appreciated, the furnace element can include a greater orlesser number of gas ports. For example, the natural gas and air and/oroxygen can be combined upstream from the furnace element, thus one portwould be required to introduce gasses into the furnace element, inanother example, one or more ports can be positioned downstream from thecombustion region to introduce one or more fluids into the passageway.As can be appreciated, many number of different arrangements for portsand port locations on the furnace element can be used. One or moremixing elements can be included in one or more of the ports and/or inpassageway 320 to facilitate in the mixing of the gasses in the furnaceelement; however, this is not required.

Referring again to FIG. 11, metal layers 302 and 304 include a groove orchannel portion 302 a, 304 a. When the two metal layers are connectedtogether, these two channels form passageway 320. As illustrated in FIG.11, each of the two channels has generally the same shape and size;however, this is not required. For example, one metal layer could have alarger groove and/or different shaped groove from the other metal layer.In another example, one metal layer can include a groove and the othermetal layer not include any type of groove. As can be appreciated, manyother or additional arrangements can be used in the furnace element.

As can be appreciated, although the processing apparatus illustrated inFIGS. 9-11 was described as a furnace element, the processing apparatuscould have other uses such as, but not limited to a reactor ormicro-reactor, heat exchanger, etc. As can also be appreciated,materials other than or in addition to gasses can be flowed through theprocessing apparatus (e.g., liquids, liquid and solid mixtures, gas andliquid mixtures, etc.).

Referring now to FIG. 12, a modification to the furnace elementillustrated in FIGS. 9-11 is set forth. As shown in FIG. 12, a naturalgas pipe 340 is connected to port 330 and an air pipe 350 is connectedto port 332. Pipe 340 includes a valve 342 to control the flow rate ofnatural gas NG into passageway 320. Pipe 350 also includes a valve 352to control the flowrate of air into passageway 320. As can beappreciated, the inclusion or use of valve 342 and/or valve 352 is notrequired. The arrows included in passageway 320 indicate the flow ofgasses through the passageway. During the combustion of the natural gasin passageway 320, carbon dioxide and water are formed. An exhaust pipe360 is connected to port 334. A valve 362 is connected to pipe 360 tocontrol the flowrate of gasses exiting the furnace element. As can beappreciated, valve 362 is not required. A vacuum pump 370 or other typeof device is illustrated as being in fluid connection with pipe 360 soas to pull a vacuum on pipe 360. The vacuum on pipe 360 can be used toincrease the pressure drop through the passageway 320 of the furnaceelement so as to facilitate in the flow of gasses through thepassageway. The amount of vacuum applied to pipe 360 can be controlledand/or set to at least partially adjust the flowrate of gasses thoughthe passageway 320 of furnace element 300.

Referring now to FIG. 13, there is illustrated a furnace burner 500 thatincludes four (4) furnace elements connected together. This arrangementcan be used to increase the BTU output. For example, if each furnaceelement was designed to generate about 10000 BTUs, and the furnaceburner needed to generate about 50000 BTUs, five (5) furnace elementscould be connected together as illustrated in FIG. 13 to generate theneeded BTU output of the furnace burner. As can be appreciated, manyother furnace element combinations can be used to generate the requiredBTU output. The furnace elements illustrated in FIG. 13 are generallyabout the same size and shape and are designed to generally output thesame amount of BTUs, however, this is not required. For instance,different shaped or sized furnace elements can be connected together.The arrangement for forming each furnace element can be the same orsimilar or different to the arrangements used to form the furnaceelements illustrated in FIGS. 9-11, 17-20 and 22. The particulararrangement of the furnace elements in FIG. 13 will be described in moredetail below.

Referring again to FIG. 13, natural gas NG from a natural gas sourceflows through a pipe 510 to furnace burner 500. Prior to the natural gasreaching the furnace burner, one or more impurities (e.g., butane,carbon dioxide, ethane, hydrogen sulfide, nitrogen, pentane, propane,various alkanes, etc.) in the natural gas can be removed; however, thisis not required. As illustrated in FIG. 13, a sulfur scrubber 520 isoptionally connected between the natural gas supply and the furnaceburner to remove some or all of the sulfur and/or sulfur compounds inthe natural gas; however, this is not required. These types of scrubbersare commonly available such as scrubbers offered by Advanced InstrumentsInc. The scrubber can be replaceable; however, this is not required. Ascan be appreciated, more than one scrubber can be used to removeimpurities from the natural gas.

FIG. 13 illustrates the natural gas passing through a valve 530 that canbe used to control the flow of natural gas into the furnace burner. Ascan be appreciated, the use of a valve is not required. A gasdistributor 540 is illustrated as dividing the source of natural gasinto one or more of the furnace elements. The gas distributor, whenused, can include one or more mechanical and/or electrical devices(e.g., valves, orifices, screens, pipe sizes, etc.) to control theamount of natural gas that flows into each furnace element. As can beappreciated, the gas distributor can be designed to automaticallycontrol and/or be used to automatically control the flow of natural gasinto one or more furnace elements; however, this is not required. Alsoor alternatively, the gas distributor can be designed to allow manualcontrol of the flow of natural gas into one or more furnace elements;however, this is not required.

FIG. 13 illustrates air passing through an air pipe 550 and throughvalve 560 that can be used to control the flow of air into the furnaceburner. As can be appreciated, the use of a valve is not required. Anair distributor, not shown, can be used to divide the source of air intoone or more of the furnace elements. The air distributor, when used, caninclude one or more mechanical and/or electrical devices (e.g., valves,orifices, screens, pipe sizes, etc.) to control the amount of air thatflows into each furnace element. As can be appreciated, the airdistributor can be designed to automatically control and/or be used toautomatically control the flow of air into one or more furnace elements;however, this is not required. Also or alternatively, the airdistributor can be designed to allow manual control of the flow of airinto one or more furnace elements; however, this is not required. As canalso be appreciated, one or more scrubbers can be used to removeimpurities from the air and/or oxygen source; however, this is notrequired.

FIG. 13 illustrates that at least one of the furnace elements includeone or more heat transfer structures in the form of a fin 570. As can beappreciated, only one of the furnace elements may include one or moreheat transfer structures, one or more of the furnace elements mayinclude one or more a heat transfer structures, or all of the furnaceelements include one or more heat structures. As can be appreciated,none of the furnace elements may include heat transfer structures. Theone or more heat transfer structures can take on forms other than or inaddition to a fin. The heat transfer structures are used to facilitatein transferring heat from one or more of the furnace elements to one ormore materials (e.g., gas, liquid, and/or solid) flowing and/orpositioned about the furnace burner. As such, the heat transferstructures are generally used to increase surface area for heattransfer. The heat transfer structures can be formed of the same ordifferent material from the furnace elements. The heat transferstructures can have the same or different shape and/or size.

FIG. 13 illustrates an exhaust accumulator 580 that combines the exhaustgasses from the plurality of furnace elements into one exhaust pipe 590.The exhaust accumulator, when used, can include one or more mechanicaland/or electrical devices (e.g., valves, orifices, screens, pipe sizes,etc.) to control the amount of exhaust gas that is received from eachfurnace element; however, this is not required. As can be appreciated,the exhaust accumulator can be designed to automatically control and/orbe used to automatically control the flow of exhaust from one or morefurnace elements; however, this is not required. Also or alternatively,the exhaust accumulator can be designed to allow manual control of theflow of exhaust from one or more furnace elements; however, this is notrequired. A valve 600 can also or alternatively be used to control ofthe flow of exhaust from one or more furnace elements and/or from theexhaust accumulator, when used; however, this is not required.

FIG. 13 illustrates a vacuum pump 610 or other type of device as beingin fluid connection with pipe 590 so as to pull a vacuum on pipe 590.The vacuum on pipe 590 can be used to increase the pressure drop throughvalve 600, when used, through exhaust accumulator 580, when used, and/orthrough one or more of the furnace elements so as to facilitate in theflow of gasses through valve 600, exhaust accumulator 580, and/or one ormore of the furnace elements. The amount of vacuum applied to pipe 590can be controlled and/or set to at least partially adjust the flowrateof gasses though valve 600, exhaust accumulator 580, and/or one or moreof the furnace elements.

FIG. 13 illustrates a micro-reactor 620 connected to pipe 590. The useof a micro-reactor is optional. The micro-reactor can be used to convertwater and carbon dioxide, both by-products of the combustion of naturalgas, into methanol and/or some other fuel. As can be appreciated, theone or more micro-reactors connected to pipe 590, when used, can be usedto form other or additional compounds. For instance, if materials otherthan or in addition to natural gas and air are passed through, combustedand/or reacted in the processing apparatus, other or additionalcompounds may be formed by the one or more micro-reactors. As can beappreciated, the micro-reactor can be at least partially formed byprocesses similar to the processes for forming the processing apparatusthat are disclosed in the present invention. As such, the micro-reactor,when used, can be formed of two or more metal layers that have beenlaminated together; however, this is not required. Many differentprocesses can be used for form methanol from carbon dioxide and water.Non-limiting examples are disclosed in U.S. Pat. Nos. 3,959,094;4,894,394; 5,037,619; 5,063,250; 5,310,506; 5,312,843; 5,342,702;5,344,848; 5,416,245; 5,472,986; 5,496,859; 5,690,482; 5,767,165;5,770,630; 5,980,782; 5,998,489; 6,005,011; 6,117,916; 6,156,234;6,171,574; 6,191,174; 6,214,314; 6,218,439; 6,353,133; 6,736,955; all ofwhich are incorporated herein by reference. The micro-reactor can be atleast partially formed of or include one or more oxidation catalysts(e.g., chromium-aluminum alloy, copper, copper-chromium alloy,molybdenum, nickel, palladium, platinum, rhodium, ruthenium, silver,vanadium, vanadium-phosphate, etc.). When the micro-reactor includes oneor more catalysts, the one or more catalysts can be supported on gammaand/or alpha alumina, and/or silica; however, this is not required.

Referring now to the four (4) furnace elements 700 in furnace burner500, each furnace element includes a metal layer 710 and two metallayers 720. As illustrated in FIG. 13, one metal layer 720 is laminatedto each side of metal layer 710. As also illustrated in FIG. 13, twometal layers 710 can share one metal layer 720; however, this is notrequired. The lamination can be the form of a high temperature adhesive(RTU silicon adhesive, ceramic adhesives, epoxy adhesives, polyimideadhesives, etc.). The lamination can also or alternatively be in theform of a brazing metal. The type of brazing metal when used generallydepends on the composition of metal layers 710, 720 and the temperatureof operation of the furnace element. Non-limiting examples of brazingmetals include, but not limited to, silver, silver-brass, silver-tin,silver-nickel, lead-tin, nickel-brass, or nickel. The metal layers 710,720 can be formed of the same or different material. Non-limitingexamples for the metal used in the metal layers includes, but is notlimited to, aluminum, aluminum alloys, copper, copper alloys, carbonsteel and/or stainless steel; however, it will be appreciated that othermetals can also be used. The thickness of the metal layers can depend inpart on 1) the number of metal layers used to form the furnace elementand 2) the size and design of the furnace element. As illustrated inFIG. 13, the furnace element is for home use and each furnace elementhas a volume of less than about 1200 cubic inches. As can beappreciated, larger or smaller furnace elements can be used. As also canbe appreciated, the furnace element can be other sizes for non-home use(e.g., commercial use, etc.). For furnace elements for home use that hasa volume of less than about 1200 cubic inches, the average thickness ofthe furnace element is about 0.2-5 inches (5080-127,000 microns), andgenerally about 0.4-2 inches (10,160-50,800 microns); however, otheraverage thicknesses can be used. The metal layers are illustrated ashaving different thickness; however, the thicknesses can be the same.Generally the thickness of metal layer 710 is at least about 25% greaterthan the thickness of metal layer 720. In one non-limiting arrangement,the average thickness of metal layer 710 is about 0.1-3 inches(2540-76,200 microns), typically about 0.2-1.5 inches (5080-38,100microns), and even more typically about 0.25-0.75 inch (6350-15,050microns). In another non-limiting arrangement, the average thickness ofmetal layer 720 is about 0.05-2 inches (1270-50800 microns), typicallyabout 0.075-1 inch (1905-25400 microns), and more typically about0.08-0.5 inch (2032-12,700 microns). As can be appreciated, many otherthickness can be used for metal layers 710 and/or 720. As can beappreciated, if furnace element is formed from thin metal layers, thenthe average thickness of the metal layers will typically be less and thenumber of metal layers used to form the furnace element will typicallybe greater. In addition, if thin metal layers are used, metal layers 710and/or 720 may be formed of a plurality of thin metal layers that havebeen laminated together; however, this is not required. The metal layersas illustrated as having a shape of a generally rectangular prism;however, it can be appreciated that one or both of the metal layers canhave other shapes.

A single passageway 730 serpentines through the middle of each furnaceelement 700. As can be appreciated, more than one passageway can existin one or more furnace elements. As also can be appreciated, passagewaypaths other than or in addition to a serpentine passageway can be usedin one or more furnace elements. If one or more furnace element includestwo or more passageways, the passageways can have the same or differentshaped pathways. Passageway 730 can have a generally circularcross-sectional shape; however, it can be appreciated that other oradditional cross-sectional shapes (e.g., polygonal, oval, etc.) can beused in one or more portions of the passageway of one or more of thepassageways. Passageway 730 is illustrated as having a generallyconstant cross-sectional size and shape along the length of thepassageway in each furnace element; however, this is not required. Forexample, when one or more materials passing through the passageway ofone or more furnace elements increase or decrease in volume and/orpressure, the cross-sectional area of one or more passageways one ormore regions of the one or more passageways can be adjusted toaccommodate for such volume change. For example, when natural gas NG andair are directed into passageways 730 and are combusted to create heat,the combustion of the gasses in the passageways in combination with theincrease in gas temperature causes the pressure to increase in thecombustion region of each of the passageways. If the cross-sectionalarea of one or more of the passageways is too small, a gas back-flow inone or more passageways may occur, thereby resulting in the improperoperation of one or more of the furnace elements. In addition oralternatively, it the cross-sectional area in one or more passageways istoo small or to large, the proper and/or most efficient combustion ofthe gasses may not occur in one or more of the furnace elements. As thegas temperature decreases downstream from the combustion region, the gaspressure may drop due to the decrease in the volume of the gas at alower temperature. As such, one or more of the furnace elements can bedesigned such that the cross-sectional area of the one or morepassageways in the combustion region is larger than other portions ofthe one or more passageways; however, this is not required.

As illustrated in FIG. 13, each furnace element 700 includes three ports740, 742, 744 that are in fluid communication with passageway 730. Gasport 740 can be used to connect to gas pipe 542 from gas distributor540. Gas port 742 can be designed to connect to pipe 550 that providesair and/or oxygen to the furnace elements. Gas port 744 can be used toconnect to an exhaust pipe 582 to convey the combusted gasses from eachfurnace element to exhaust gas accumulator 580. One or more of the portscan include connection arrangements to facilitate in connecting a pipe,tube, etc. to one or more of the ports; however, this is not required.As can also be appreciated, each furnace element can include a greateror lesser number of gas ports. For example, the natural gas and airand/or oxygen can be combined upstream from one or more of the furnaceelements, thus one port would be required to introduce gasses into oneor more of the furnace elements. In another example, one or more portscan be positioned downstream from the combustion region to introduce oneor more fluids into one or more of the passageways 730 of one or more ofthe furnace elements and/or to remove combusted gasses from one or moreof the passageways 730. As can be appreciated, many number of differentarrangements for ports and port locations on one or more of the furnaceelements can be used. One or more mixing elements can be included in oneor more of the ports and/or in passageway 730 of one or more of thefurnace elements to facilitate in the mixing of gasses in one or more ofthe furnace elements; however, this is not required.

As illustrated in FIG. 13, metal layer 710 includes a groove or channelportion that traverses the complete thickness of metal layer 710. Metallayers 720 are illustrated as not including channels or grooves. Whenmetal layers 720 are connected to each side of metal layer 710,passageway 730 is formed. As can be appreciated, many other oradditional arrangements can be used to form one or more portions of thepassageway 730 in one or more of the furnace elements. For example,metal layer 720 can include a channel or groove that is less than thethickness of the metal layer. In another example, metal layer 720 caninclude a slot or groove that is used to at least partially formpassageway 730.

In operation, the processing apparatus illustrated in FIG. 13 can beused to generate heat in a furnace and also produce a fuel such asmethanol from the exhaust gasses from the combustion of the natural gas.The basic furnace burner 500 includes the natural gas source, the airsource, the gas distributor 540, the plurality of furnace elements 700,and the exhaust gas accumulator 580. The plurality of fins 570 can beused to increase heat transfer between the one or more furnace elementsand the air moving over the surface of the furnace elements; however,this is not required. The vacuum pump 610 can be used to facilitate indrawing gasses through one or more passageways 730 in one or more of thefurnace elements; however, this is not required. When one or more of theexhaust gasses are to be processed in one or more micro-reactor 620, asulfur scrubber 520 can be used; however, this is not required.

Referring now to FIGS. 21 and 22, there is illustrated anothernon-limiting furnace burner 800 that includes three (3) furnace elementsconnected together. This arrangement can be used to increase the BTUoutput. For example, if each furnace element was designed to generateabout 15000 BTUs, and the furnace burner needed to generate about 60000BTUs, four (4) furnace elements could be connected together asillustrated in FIG. 21 to generate the needed BTU output of the furnaceburner. As can be appreciated, many other furnace element combinationscan be used to generate the required BTU output. The furnace elementsillustrated in FIG. 21 are generally about the same size and shape andare designed to generally output the same amount of BTUs, however, thisis not required. For instance, different shaped or sized furnaceelements can be connected together. The arrangement for forming eachfurnace element can be the same or similar or different to thearrangements used to form the furnace elements illustrated in FIGS.9-11, 13, 17-20 and 22. The particular arrangement of the furnaceelements in FIG. 21 will be described in more detail below.

Referring again to FIG. 21, natural gas NG from a natural gas sourceflows through a pipe 810 to furnace burner 800. Prior to the natural gasreaching the furnace burner, one or more impurities in the natural gascan be removed; however, this is not required. One or more sulfurscrubbers, not shown, can be optionally connected between the naturalgas supply and the furnace burner to remove some or all of the sulfurand/or sulfur compounds in the natural gas; however, this is notrequired.

FIG. 21 illustrates the natural gas passing through a valve 830 that canbe used to control the flow of natural gas into the furnace burner. Ascan be appreciated, the use of a valve is not required. A gasdistributor 840 is illustrated as dividing the source of natural gasinto one or more of the furnace elements. The gas distributor, whenused, can include one or more mechanical and/or electrical devices tocontrol the amount of natural gas that flows into each furnace element.As can be appreciated, the gas distributor can be designed toautomatically control and/or be used to automatically control the flowof natural gas into one or more furnace elements; however, this is notrequired. Also or alternatively, the gas distributor can be designed toallow manual control of the flow of natural gas into one or more furnaceelements; however, this is not required.

FIG. 21 illustrates air passing through an air pipe 850 and throughvalve 860 that can be used to control the flow of air into the furnaceburner. As can be appreciated, the use of a valve is not required. Anair distributor, not shown, can be used to divide the source of air intoone or more of the furnace elements. The air distributor, when used, caninclude one or more mechanical and/or electrical devices to control theamount of air that flows into each furnace element. As can beappreciated, the air distributor can be designed to automaticallycontrol and/or be used to automatically control the flow of air into oneor more furnace elements; however, this is not required. Also oralternatively, the air distributor can be designed to allow manualcontrol of the flow of air into one or more furnace elements; however,this is not required. As can also be appreciated, one or more scrubberscan be used to remove impurities from the air and/or oxygen source;however, this is not required.

One or more of the furnace elements can include one or more heattransfer structures to facilitate in transferring heat from one or moreof the furnace elements to one or more materials flowing and/orpositioned about the furnace burner; however, this is not required. Theheat transfer structures are generally used to increase surface area forheat transfer. The heat transfer structures can be formed of the same ordifferent material from the furnace elements. The heat transferstructures can have the same or different shape and/or size.

FIG. 21 illustrates an exhaust accumulator 880 that combines the exhaustgasses from the plurality of furnace elements into one exhaust pipe 890.The exhaust accumulator, when used, can include one or more mechanicaland/or electrical devices to control the amount of exhaust gas that isreceived from each furnace element; however, this is not required. Ascan be appreciated, the exhaust accumulator can be designed toautomatically control and/or be used to automatically control the flowof exhaust from one or more furnace elements; however, this is notrequired. Also or alternatively, the exhaust accumulator can be designedto allow manual control of the flow of exhaust from one or more furnaceelements; however, this is not required. A valve 900 can also oralternatively be used to control the flow of exhaust from one or morefurnace elements and/or from the exhaust accumulator, when used;however, this is not required.

FIG. 21 illustrates a vacuum pump 910 or other type of device as beingin fluid connection with pipe 890 so as to pull a vacuum on pipe 890.The vacuum on pipe 890 can be used to increase the pressure drop throughvalve 900, when used, through exhaust accumulator 880, when used, and/orthrough one or more of the furnace elements so as to facilitate in theflow of gasses through valve 900, exhaust accumulator 880), and/or oneor more of the furnace elements. The amount of vacuum applied to pipe890 can be controlled and/or set to at least partially adjust theflowrate of gasses though valve 900, exhaust accumulator 880, and/or oneor more of the furnace elements.

A micro-reactor, not shown, can be connected to pipe 890. The use of amicro-reactor is optional. The micro-reactor can be used to convertwater and carbon dioxide, both by-products of the combustion of naturalgas, into methanol and/or some other fuel. As can be appreciated, theone or more micro-reactors connected to pipe 890, when used, can be usedto form other or additional compounds.

Referring again to FIG. 21, there are three (3) furnace elements 1000 infurnace burner 800, each furnace element includes a metal layer 1010, ametal layer 1020, and three metal layers 1030. As illustrated in FIG.21, one metal layer 1030 is laminated to each side of metal layers 1100and 1020. As also illustrated in FIG. 21, metal layers 1010 and 1020 canshare one metal layer 1030; however, this is not required. Thelamination can be in the form of a high temperature adhesive. Thelamination can also or alternatively be in the form of a brazing metal.The type of brazing metal, when used, generally depends on thecomposition of metal layers 1010, 1020, 1030 and the temperature ofoperation of the furnace element. The metal layers 1010, 1020, 1030 canbe formed of the same or different material. The thickness of the metallayers can depend in part on 1) the number of metal layers used to formthe furnace element and 2) the size and design of the furnace element.As illustrated in FIG. 21, the furnace element is for home use and eachfurnace element has a volume of less than about 1200 cubic inches. Ascan be appreciated, larger or smaller furnace elements can be used. Asalso can be appreciated, the furnace element can be other sizes fornon-home use (e.g., commercial use, etc.). For furnace elements for homeuse that has a volume of less than about 1200 cubic inches, the averagethickness of the furnace element is about 0.2-5 inches (5080-127,000microns), and generally about 0.4-2 inches (10,160-50,800 microns);however, other average thicknesses can be used. The metal layers areillustrated as having different thickness; however, the thicknesses canbe the same. Generally the thickness of metal layers 1010 and/or 1020are at least about 25% greater than the thickness of metal layer 1030.In one non-limiting arrangement, the average thickness of metal layers1010 and/1020 is about 0.1-3 inches (2540-76,200 microns), typicallyabout 0.2-1.5 inches (5080-38,100 microns), and even more typicallyabout 0.25-0.75 inch (6350-15,050 microns). In another non-limitingarrangement, the average thickness of metal layer 1030 is about 0.05-2inches (1270-50800 microns), typically about 0.075-1 inch (1905-25400microns), and more typically about 0.08-0.5 inch (2032-12,700 microns).As can be appreciated, many other thicknesses can be used for metallayers 1010, 1020 and/or 1030. As can be appreciated, if furnace elementis formed from thin metal layers, then the average thickness of themetal layers will typically be less and the number of metal layers usedto form the furnace element will typically be greater. In addition, ifthin metal layers are used, metal layers 1010, 1020 and/or 1030 may beformed of a plurality of thin metal layers that have been laminatedtogether; however, this is not required. The metal layers as illustratedas having a shape of a generally rectangular prism; however, it can beappreciated that one or both of the metal layers can have other shapes.

Referring now to FIG. 22, two passageways 1040, 1050 serpentine throughthe middle of each furnace element 1000. As can be appreciated, morethan two passageways can exist in one or more furnace elements. As alsocan be appreciated, passageway paths other than or in addition to aserpentine passageway can be used in one or more furnace elements. Thetwo or more passageways in each furnace element can have the same ordifferent shaped pathways. Passageways 1040, 1050 can have a generallycircular cross-sectional shape; however, it can be appreciated thatother or additional cross-sectional shapes can be used in one or moreportions of the passageway of one or more of the passageways.Passageways 1040, 1050 are illustrated has having a generally constantcross-sectional size and shape along the length of the passageway ineach furnace element; however, this is not required. For example, whenone or more materials passing through the passageway of one or morefurnace elements increase or decrease in volume and/or pressure, thecross-sectional area of one or more passageways one or more regions ofthe one or more passageways can be adjusted to accommodate for suchvolume change. For example, when natural gas NG and air are directedinto passageway 1040 of each furnace element and are combusted to createheat, the combustion of the gasses in the passageways in combinationwith the increase in gas temperature causes the pressure to increase inthe combustion region of each of the passageways. If the cross-sectionalarea of one or more of the passageways is too small, a gas back-flow inone or more passageways may occur, thereby resulting in the improperoperation of one or more of the furnace elements. In addition oralternative, it the cross-sectional area in one or more passageways istoo small or to large, the proper and/or most efficient combustion ofthe gasses may not occur in one or more of the furnace elements. As thegas temperature decreases downstream from the combustion region, the gaspressure may drop due to the decrease in the volume of the gas at alower temperature. As such, one or more of the furnace elements can bedesigned such that the cross-sectional area of the one or morepassageways in the combustion region is larger than other portions ofthe one or more passageways; however, this is not required. Passageways1040 and 1050 are illustrated as not being mirror images of one another;however, this is not required. As can be appreciated, any flow patternfor passageways 1040 and 1050 can be designed in one or more of thefurnace elements.

As also illustrated in FIG. 22, passageway 1050 in metal layer 1020 isdesigned to convey a fluid that is used to absorb heat generated inpassageway 1040. The fluid that flows through passageway 1040 can be agas and/or liquid. Non-limiting examples of liquids and gasses include,but are not limited to, water, steam, oil, glycol, water-glycolmixtures, alcohol, water-alcohol mixtures, etc. As can be appreciated, aliquid flowing through passageway 1040 can be at least partiallyconverted to a gas; however, this is not required.

As illustrated in FIG. 22, each furnace element 1000 includes five ports1100, 1102, 1104, 1106, 1108. Ports 1100, 1102 and 1104 are in fluidcommunication with passageway 1040. Ports 1106 and 1108 are in fluidcommunication with passageway 1050. Gas port 1100 can be used to connectto gas pipe 842 from gas distributor 840. Gas port 1102 can be designedto connect to pipe 850 that provides air and/or oxygen to the furnaceelements. Gas port 1104 can be used to connect to an exhaust pipe 882 toconvey the combusted gasses from each furnace element to exhaust gasaccumulator 880. One or more of the ports can include connectionarrangements to facilitate in connecting a pipe, tube, etc. to one ormore of the ports; however, this is not required. As can also beappreciated, each furnace element can include a greater or lesser numberof gas ports. For example, the natural gas and air and or oxygen can becombined upstream from one or more of the furnace elements, thus oneport would be required to introduce gasses into one or more of thefurnace elements. In another example, one or more ports can bepositioned downstream from the combustion region to introduce one ormore fluids into one or more of the passageways 1040 of one or more ofthe furnace elements and/or to remove combusted gasses from one or moreof the passageways 1040. One or more of the ports can include connectionarrangements to facilitate in connecting a pipe, tube, etc. to one ormore of the ports; however, this is not required. As can also beappreciated, each furnace element can include a greater or lesser numberof gas ports. For example, the natural gas and air and/or oxygen can becombined upstream from one or more of the furnace elements, thus oneport would be required to introduce gasses into one or more of thefurnace elements. As can be appreciated, many number of differentarrangements for ports and port locations on one or more of the furnaceelements can be used. One or more mixing elements can be included in oneor more of the ports and/or in passageway 1040 of one or more of thefurnace elements to facilitate in the mixing of gasses in one or more ofthe furnace elements; however, this is not required. As can beappreciated, many number of different arrangements for ports and portlocations on one or more of the furnace elements can be used. One ormore mixing elements can be included in one or more of the ports and/orin passageway 1040 of one or more of the furnace elements to facilitatein the mixing of gasses in one or more of the furnace elements; however,this is not required. Port 1106 can be used to connect to a fluid pipe1120 to enable a cooling fluid to flow into passageway 1050. Port 1108can be used to connect to a fluid pipe 1130 to enable cooling fluid thatis flowing in passageway 1050 to exit the fluid passageway. One or moreof the ports can include connection arrangements to facilitate inconnecting a pipe, tube, etc. to one or more of the ports; however, thisis not required. As can also be appreciated, each furnace element caninclude a greater or lesser number of cooling fluid ports. In anotherexample, one or more cooling fluid ports can be positioned downstreamfrom the entrance to passageway 1050 to introduce one or more coolingfluids into one or more of the passageways 1050 of one or more of thefurnace elements and/or to remove heated cooling fluid from one or moreof the passageways 1050. As can be appreciated, many number of differentarrangements for ports and port locations on one or more of the furnaceelements can be used.

As illustrated in FIG. 22, metal layers 1010 and 1020 include a grooveor channel portion that traverses the complete thickness of metal layers1010 and 1020. Metal layers 1030 are illustrated as not includingchannels or grooves. When metal layers 1030 are connected to each sideof metal layers 1010, 1020, passageway 1040, 1050, respectively, areformed. As can be appreciated, many other or additional arrangements canbe used to form one or more portions of the passageways 1040 and/or 1050in one or more of the furnace elements. For example, metal layer 1030can include a channel or groove that is less than the thickness of themetal layer. In another example, metal layer 1030 can include a slot orgroove that is used to at least partially form passageway 1040 and/or1050.

Referring again to FIG. 21, furnace burner 800 includes a radiatorarrangement 1140 and a pump 1150. Radiator arrangement can be any designthat enables a fluid such as air to flow into and/or about at least aportion of the radiator so that heat can be transferred between theflowing fluid and the radiator arrangement. One non-limiting radiatorarrangement is one that is similar to a radiator of a vehicle; however,this is not required. Pump 1150 is designed to pump and circulate fluidthrough fluid pipes 1120 and 1130 and radiator arrangement 1140. As canbe appreciated, more than one pump can be used. Although not shown,fluid pipe 1120 and/or 1130 can include one or more valves to controlthe flow of fluid into and/or out of one to more furnace elements;however, this is not required.

In operation, the processing apparatus illustrated in FIG. 21 can beused to generate heat in a furnace. The processing apparatus could alsobe used to produce a fuel such as methanol from the exhaust gasses fromthe combustion of the natural gas; however, this is not required. Thebasic furnace burner 800 includes the natural gas source, the airsource, the gas distributor 840, the plurality of furnace elements 1000,the exhaust gas accumulator 880, radiator 1140 and pump 1150. The vacuumpump 910 can be used to facilitate in drawing gasses through one or morepassageways 1040 in one or more of the furnace elements 1000; however,this is not required. The furnace elements can be located in a locationremote from the radiator arrangement, however, this is not required. Forexample, the furnace elements could be located outside a house orbuilding and the radiator arrangement could be located inside a blowerunit that is used to blow air over the radiator arrangement and conveythe heated air through vents and/or registers throughout the home orbuilding; however, this is not required.

Referring now to FIGS. 14-16, one or more materials and/or catalysts canbe inserted into one or more portions of the passageway of one or morefurnace elements to 1) facilitate in the combustion of the natural gasin the one or more passageways of one or more furnace elements, 2) to atleast partially control the rate of combustion of the natural gas in theone or more passageways of one or more furnace elements, 3) to convertone or more by-products of the combustion of the natural gas in one ormore other compounds and/or elements in one or more passageways of oneor more furnace elements, 4) at least partially improve the heattransfer into or out of one or more passageways of one or more furnaceelements, and/or 5) to remove one or more impurities in the exhaust gasin one or more passageways of one or more furnace elements. The use ofone or more catalysts in one or more passageways of one or more furnaceelements can be used in the furnace elements described above with regardto FIGS. 9-13 and 21-22 and/or below with regard to FIGS. 17-20.

Referring now to FIG. 14, there is illustrated a cross-section of aportion of a furnace element 1200. As shown in FIG. 14, a natural gaspipe 1210 is connected to port 1220 and an air pipe 1240 is connected toport 1250. Pipe 1210 includes a valve 1212 to control the flow rate ofnatural gas NG into passageway 1300. Pipe 1240 also includes a valve1242 to control the flowrate of air into passageway 1300. As can beappreciated, the inclusion or use of valve 1212 and/or valve 1242 is notrequired. The arrows included in passageway 1300 indicate the flow ofgasses through passageway 1300. Passageway 1300 is at least partiallyformed in metal layer 1310. During the combustion of the natural gas inpassageway 1300, carbon dioxide and water are formed. An exhaust pipe1260 is connected to port 1270. A valve 1280 is connected to pipe 1260to control the flowrate of gasses exiting the furnace element. As can beappreciated, valve 1280 is not required. A vacuum pump 1320 or othertype of device is illustrated as being in fluid connection with pipe1260 so as to pull a vacuum on pipe 1260. The vacuum on pipe 1260 can beused to increase the pressure drop through the passageway 1300 of thefurnace element so as to facilitate in the flow of gasses through thepassageway. The amount of vacuum applied to pipe 1260 can be controlledand/or set to at least partially adjust the flowrate of gasses thoughthe passageway 1300 of furnace element 1200; however, this is notrequired.

Although not shown, metal layer 1310 can be laminated to one or moreother metal layers; however, this is not required. When a laminate isused, the laminate can be an adhesive and/or a brazing metal; however,this is not required. The laminate, when used, generally depends on thecomposition of metal layers that form the furnace element and thetemperature of operation of the furnace element. The metal layers can beformed of the same or different material. The types of metal for themetal layers, the type of adhesive, and/or the type of brazing metal canbe the same or different from the materials discussed above with regardto furnace element 300 of FIGS. 9-13. The thickness of the metal layersin furnace element 1200 can depend in part on 1) the number of metallayers used to form the furnace element and 2) the size and design ofthe furnace element. Non-limiting examples of brazing metals that can beused include, but not limited to, silver, silver-brass, silver-tin,silver-nickel, lead-tin, nickel-brass, or nickel. Non-limiting examplesfor the metal used in the metal layers includes, but is not limited to,aluminum, aluminum alloys, copper, copper alloys, carbon steel and/orstainless steel; however, it will be appreciated that other metals canalso be used. As can also be appreciated, many of thickness can be usedfor metal layers that are used to for the furnace element. As can beappreciated, if furnace element is formed from thin metal layers, thenthe average thickness of the metal layers will typically be less and thenumber of metal layers used to form the furnace element will typicallybe greater. In addition, if thin metal layers are used, one or more ofthe metal layers can be formed of a plurality of thin metal layers thathave been laminated together; however, this is not required. Metal layer1200 is illustrated as having a shape of a generally rectangular prism;however, it can be appreciated that one or more of the metal layers usedto form the furnace element can have other shapes.

As shown in FIG. 14, a single passageway 1300 serpentines through thefurnace element 1200. As can be appreciated, more than one passagewaycan exist in the furnace element. As also can be appreciated, passagewaypaths other than or in addition to a serpentine passageway can be used.If the furnace element includes two or more passageways, the passagewayscan have the same or different shaped pathways. Passageway 1300 isillustrated as having a generally circular cross-sectional shape;however, it can be appreciated that other or additional cross-sectionalshapes (e.g., polygonal, oval etc.) can be used in one or more portionsof the passageway. Passageway 1300 is illustrated has having a generallyconstant cross-sectional size and shape along the length of thepassageway; however, this is not required.

As illustrated in FIG. 14, a catalyst 1400 or other type of material islocated in one or more portions of passageway 1300. As shown in FIG. 13,catalyst 1400 is positioned throughout passageway 1300; however, it canbe appreciated that less than about 90%, less than about 80%, less thanabout 70%, less than about 60%, less than about 50%, less than about40%, less than about 30%, less than about 20% and/or less than about 10%of the passageway may include catalyst 1400. The catalyst in one or moreportions of the passageway can have the same or different size and/orshape. In one non-limiting embodiment, the catalyst is designed to 1)improve and/or control the rate of combustion in one or more portions ofthe passageway, 2) at least partially convert carbon monoxide intocarbon dioxide, and/or 3) remove nitrogen and/or sulfur compounds fromthe exhaust gas. As can be appreciated, the catalyst can have other oradditional uses. One non-limiting catalyst or material that can be usedto improve and/or control the rate of combustion in one or more portionsof the passageway is a calcined alumina material. One non-limitingcatalyst that can be used to at least partially convert carbon monoxideinto carbon dioxide is a platinum-alumina based catalyst.

Referring now to FIGS. 15 and 16, the furnace element is shown toinclude more than one type of catalyst in passageway 1300. Asillustrated in FIG. 15, two catalysts 1400 and 1410 are included in oneor more portions of passageway 1300. Catalyst 1410 is positioned downstream from catalyst 1400. In one non-limiting arrangement, catalyst1400 is designed to improve and/or control the rate of combustion in oneor more portions of the passageway, and catalyst 1410 is designed to atleast partially convert carbon monoxide into carbon dioxide, and/orremove nitrogen and/or sulfur compounds from the exhaust gas. In anothernon-limiting arrangement, catalyst 1400 is designed to improve and/orcontrol the rate of combustion in one or more portions of the passagewayand/or at least partially convert carbon monoxide into carbon dioxide,and catalyst 1410 is designed to remove nitrogen and/or sulfur compoundsfrom the exhaust gas. As illustrated in FIG. 16, three catalysts 1400,1410 and 1420 are included in one or more portions of passageway 1300.Catalyst 1410 is positioned down stream from catalyst 1400, and catalyst1420 is positioned downstream from catalyst 1410. In one non-limitingarrangement, catalyst 1400 is designed to improve and/or control therate of combustion in one or more portions of the passageway, catalyst1410 is designed to at least partially convert carbon monoxide intocarbon dioxide, and catalyst 1420 is designed to remove nitrogen and/orsulfur compounds from the exhaust gas. Although one, two or threecatalysts are disclosed in passageway 1300, it can be appreciated thatmore than three catalysts can be included in passageway 1300. As alsocan be appreciated, one, two, three, four and five specific functions ofthe catalysts were disclosed; however, it can be appreciated that morethan five functions of the catalyst can occur in the passageway.

Referring again to FIGS. 15 and 16, additional air passageways 1252 areillustrated. For example, when at least partially converting carbonmonoxide into carbon dioxide, and/or removing nitrogen and/or sulfurcompounds from the exhaust gas, and additional oxygen and/or nitrogensource may be required. Passageways 1252 can be used to provide airand/or other types of fluids to one or more regions of the passageway.

Referring now to FIGS. 17-20, there is illustrated another non-limitingarrangement of a processing apparatus in accordance with the presentinvention. This processing apparatus will also be described as a furnaceelement 400; however, it will be appreciated that the processingapparatus can be used as a reactor, micro-reactor, heat exchanger, etc.Although furnace element 400 has a different configuration from furnaceelement 300 illustrated in FIGS. 9-16 and 21-22, it will be appreciatedthat furnace element 400 can be designed to include valves, additionalports, port connection arrangements, port mixers, scrubbers, vacuumdevices, catalysts, heat fins and/or micro-reactors; however, this isnot required. As also can be appreciated, furnace element 400 can beconnected to a plurality of furnace elements 400, and/or other furnaceelements as described above with regard to FIGS. 13 and 21; however,this is not required. Furthermore, it can be appreciated that furnaceelement 400 can be used in combination with a fluid cooling arrangementas described above with regard to FIGS. 21 and 22; however, this is notrequired.

As illustrated in FIGS. 17-20, furnace element 400 is formed of aplurality of metal layers 402, 404 that are laminated together by alaminate 410. The lamination can be the form of a high temperatureadhesive a brazing metal, etc. The laminate used generally depends onthe composition of metal layers 402, 404 and the temperature ofoperation of the furnace element. The metal layers can be formed of thesame or different material. The types of metal for the metal layers, thetype of adhesive, and/or the type of brazing metal can be the same ordifferent from the materials discussed above with regard to furnaceelement 300 of FIGS. 9-11. The thickness of the metal layers in furnaceelement 400 can depend in part on 1) the number of metal layers used toform the furnace element and 2) the size and design of the furnaceelement. As illustrated in FIGS. 17-20, the furnace element is formed ofnine (9) layers; however, it can be appreciated that a larger or smallernumber of metal layers can be used to form the furnace element. For thefurnace element illustrated in FIGS. 17-20, the furnace element is forhome use and has a volume of less than about 1200 cubic inches. As canbe appreciated, larger or smaller furnace elements can be used. As alsocan be appreciated, the furnace element can be other sizes for non-homeuse (e.g., commercial use, etc.). For the furnace element for home usethat has a volume of less than about 1200 cubic inches, the averagethickness of the furnace element is about 0.2-5 inches (5080-127,000microns), and generally about 0.4-2 inches (10160-50800 microns);however, other average thicknesses can be used. The metal layers 402,404 are illustrated as having different thickness; however, this is notrequired. Generally the thickness of metal layer 404 is at least about25% greater than the thickness of metal layer 402. In one non-limitingarrangement, the average thickness of metal layer 404 is about 0.1-3inches (2540-76,200 microns), typically about 0.2-1.5 inches(5080-38,100 microns), and even more typically about 0.25-0.75 inch(6350-15,050 microns). In another non-limiting arrangement, the averagethickness of metal layer 404 is about 0.05-2 inches (1270-50800microns), typically about 0.075-1 inch (1905-25400 microns), and moretypically about 0.08-0.5 inch (2032-12,700 microns). As can beappreciated, many other thicknesses can be used for metal layers 402and/or 404. As can be appreciated, if furnace element is formed fromthin metal layers, then the average thickness of the metal layers willtypically be less and the number of metal layers used to form thefurnace element will typically be greater. In addition, if thin metallayers are used, metal layers 404 and/or 402 may be formed of aplurality of thin metal layers that have been laminated together;however, this is not required. The metal layers are illustrated ashaving a shape of a generally rectangular prism; however, it can beappreciated that one or both of the metal layers can have other shapes.

As best shown in FIG. 18, a single passageway 420 serpentines throughthe middle of the furnace element 400. As can be appreciated, more thanone passageway can exist in the furnace element. As also can beappreciated, passageway paths other than or in addition to a serpentinepassageway can be used. If the furnace element includes two or morepassageways, the passageways can have the same or different shapedpathways. Passageway 420 is illustrated as having a generallyrectangular cross-sectional shape as illustrated in FIG. 17-20; however,it can be appreciated that other or additional cross-sectional shapes(e.g., circular, other polygonal shapes, oval, etc.) can be used in oneor more portions of the passageway. Passageway 420 is illustrated ashaving a generally constant cross-sectional size and shape along thelength of the passageway; however, this is not required. For example,when one or more materials passing through the passageway increase ordecrease in volume and/or pressure, the cross-sectional area of thepassageway of one or more regions of the passageway can be adjusted toaccommodate for such volume change.

As illustrated in FIG. 17, the furnace element 400 includes two ports410, 412 that are in fluid communication with passageway 420. Port 410can be used to connect to a natural gas source and/or oxygen source, orvice versa. Gas port 412 can be used to connect to an exhaust pipe toconvey the combusted gasses from the furnace element. One or more of theports can include connection arrangements to facilitate in connecting apipe, tube, etc. to one or more of the ports; however, this is notrequired. As can also be appreciated, the furnace element can include agreater or lesser number of gas ports. For example, the natural gas andair and/or oxygen can separate ports, thus the furnace element wouldhave at least three ports. In another example, one or more ports can bepositioned downstream from the combustion region to introduce one ormore fluids into the passageway and/or to remove combusted gasses fromone or more of the passageways. As can be appreciated, many number ofdifferent arrangements for ports and port locations on the furnaceelement can be used. One or more mixing elements can be included in oneor more of the ports and/or in passageway 420 to facilitate in themixing of the gasses in the furnace element; however, this is notrequired.

Referring again to FIG. 20, metal layer 420 includes a groove or channelportion 422 that traverses the complete thickness of metal layer 404.Metal layers 402 are illustrated as not including and channels orgrooves. When metal layers 402 are connected to each side of metal layer404, passageway 420 is formed. As can be appreciated, many other oradditional arrangements can be used to form one or more portions ofpassageway 420. For example, metal layer 404 can include a channel orgroove that is less than the thickness of the metal layer. In anotherexample, metal layer 402 can include a slot or groove that is used to atleast partially form passageway 420.

As illustrated in FIGS. 17, 19 and 20, at least one metal layer 402includes passage opening 406. As also illustrated in FIGS. 17 and 20,the outer layer of the furnace element that is each formed by metallayer 402 does not include an opening 406; however, this is notrequired. Opening 406 is designed to create a fluid connection betweenthe channel or groove in metal layers 404. As such, when the metallayers are assembled together, materials are able to flow into port 410and out port 412 as indicated by the arrows in FIGS. 18-20. As can beappreciated, the location of openings 406 is non-limiting, thus anyconceivable flow pattern through the furnace element can be created, andall such flow patterns are encompassed by this invention. Opening 406 isillustrated as being a generally circular opening; however, otheropening shapes can be used.

As can be appreciated, although the processing apparatus illustrated inFIGS. 17-20 was described as a furnace element, the processing apparatuscould have other uses such as, but not limited to a reactor ormicro-reactor, heat exchanger, etc. As can also be appreciated,materials other than or in addition to gasses can be flowed through theprocessing apparatus (e.g., liquids, liquid and solid mixtures, gas andliquid mixtures, etc.).

Referring now to FIGS. 23-25, there are illustrated three non-limitingfluid mixing devices 1500, 1510, 1520. These three devices can be usedto facilitate in the mixing of two or more fluids in one or morepassageways of the processing apparatus. These three devices can be usedto facilitate in alternating the flow pattern of one or more fluids inone or more passageways of the processing apparatus. These three devicescan be incorporated in the processing apparatus and/or be positioned soas to affect one or more fluids flowing into and/or out of one or morepassageways of the processing apparatus. The mixing and/or alternationof fluid flow patterns in one or more portions of one or morepassageways of the processing apparatus can be used to, but not limitedto, 1) positively affect desired heat transfer rates, 2) improve and/orcontrol reaction and/or combustion rates of one or more fluids, and/or3) obtained desired flow fluid patterns and/or fluid mixing rates. Ascan be appreciated, the fluid mixing devices can do other or differentfunctions. When more than one fluid mixing device is used, the fluidmixing devices can have the same or different size and/or shape. Asmentioned above, the fluid mixing devices are examples of just a few ofthe fluid mixing devices that can be used in the present invention.

Referring now to FIG. 23, fluid mixing device 1500 includes a centralcavity 1502 that can be connected at one side to a pipe P and/orpassageway of a processing apparatus. The outer surface 1504 of thefluid mixing devices includes a plurality of arcuate fins 1506. As canbe appreciated, the number of fins, the size of the fins and/or shape ofthe fins can be varied. In this arrangement, one or more fluids flowthrough pipe P and through central cavity 1502. In addition, one or morefluids also flow past fins 1506. The one or more fluids that flowthrough cavity 1502 and past fins 1506 can be the same or different. Thefluid pattern of the fluids flowing through cavity 1502 and past fins1506 are different and generally result in rapid mixing of the fluidsdown stream from fluid mixing device 1500. Referring now to FIG. 24,fluid mixing device 1510 functions in a similar manner as the fluidmixing device illustrated in FIG. 23. The fin 1510 position and finprofile on fluid mixing device 1510 is different than fin position andfin profile on fluid mixing device 1500. As such, fluid mixing device1510 includes a central cavity 1514 that can be connected at one side toa pipe and/or passageway, not shown. The outer surface 1516 of the fluidmixing devices includes a plurality of arcuate fins 1512.

Referring now to FIGS. 24-25, fluid mixing device 1520 has a partialcone-shape. The fluid mixing device 1520 includes a central cavity 1522and has a tapering cross-sectional area. The fluid mixing device 1520also includes an outer surface 1524 that is absent fins. The fluid canbe designed to flow through the central cavity and/or about the outersurface of the fluid mixing device. Although the outer surface and thesurface of the central cavity are illustrated as being smooth, one orboth surfaces can include grooves, ridges, and the like.

Although the apparatus and method of the present invention has beenparticularly directed to the manufacture of processing apparatus such amicro-reactors and furnace elements, the technology of the presentinvention can be used in other fields of use. Among the many conceivablefields of use, technology areas, and devices which can utilize themethod of manufacture of the present invention include, but are notlimited to, the automotive industry in the fields of inertialmeasurement, micro-scale power generation, pressure measurement, fluiddynamics and the like (e.g., accelerometers, rate sensors, vibrationsensors, pressure sensors, fuel cells, fuel processors, nozzletechnology, valves and regulators, pumps, filters, catalytic converters,relays, actuators, heaters, etc.), the avionics industry in the fieldsof inertial measurement, RF technology, communications, activestructures and surfaces and the like (e.g., conformable MEMS (active andpassive), micro-satellite components, micro-thrusters, RF switches,antennas, phase shifters, displays, optical switches, accelerometers,rate sensors, vibration sensors, pressure sensors, fuel cells, fuelprocessors, nozzle technology, valves and regulators, pumps, filters,relays, actuators, heaters, rocket engines and/or other propulsionsystems, etc.), the biological, biotechnology and chemical industry inthe fields of micro-fluidics, microbiology, DNA assays, chemicaltesting, chemical processing other than the use of micro-reactors,lab-on-a-chip, tissue engineering, analytical instrumentation,bio-filtration, test and measurement, bio-computing, biomedical imagingand the like (e.g., biosensors, bioelectronic components, reactionwells, microtiterplates, pin arrays, valves, pumps, microwells andmicrowell arrays, microvalves, micropumps, valve seats, valve actuators(diaphragm), cavity chamber, actuator diaphragm, bio-filters, SEM, EDS,ICP, x-ray mapping, x-ray crystallography, tissue scaffolding, screens,filters, microscopes, cell sorting and filtration membranes, etc.), themedical (diagnostic and therapeutic) industry in the fields of imaging,computed tomography, angiography, fluoroscopy, radiography,interventional radiography, orthopedic, cardiac and vascular devices,catheter based tools and devices, non-invasive surgical devices, medicaltubing, fasteners, surgical cutting tools and the like (e.g., airways,balloon catheters, clips, compression bars, stents, drainage tubes, earplugs, microwells and microwell arrays, microvalves, micropumps, drugdelivery chips, microwell detectors, gas proportional counters, valveseats, valve actuators (diaphragm), cavity chamber, actuator diaphragm,hearing aids, electrosurgical hand pieces and tubing, feeding devices,balloon cuffs, wire/fluid coextrusions, lumen assemblies, infusionsleeves/test chambers, introducer tips/flexible sheaths,seals/stoppers/valves, septums, shunts, implants prosthetic devices,membranes, electrode arrays, ultra-sound transducers infra-red radiationsensors, radiopaque targets or markers, scatter grids, detector arrays,etc.), the military industry in the fields of weapon safeing, arming andfusing, miniature analytical instruments, biomedical sensors, inertialmeasurement, distributed sensing and control, information technology andthe like (e.g., MEMS fuse/safe-arm devices, ordinance guidance andcontrol devices, gyroscopes, accelerometers, GPS, disposable sensors,spectrometers, active MEMS surfaces (large area), micro-mirror MEMSdisplays, etc.), the telecommunications industry in the fields ofoptical switches, displays, adaptive optics, and the like (e.g.,micro-relays, optical attenuators, photonic switches, micro-channelplates, optical switches, displays, etc.), the energy industry (e.g.,fuel cells, solar cells, automotive fuel production from natural gas,methane processing, methanol production, ethylene production, catalyticcracking of petroleum products, production of alcohols from natural gas,coal gasification processes, hydrogenation processes [e.g., fats and/oroils hydrogenation, etc.], etc.), the environmental industry (e.g.,pollution and/or waste control systems, landfill gas processing,methanol production from CO₂, reduction of NO_(x) and/or SO_(x) gasses,water purification systems, etc.), the heat exchange industry, and/orthe extrusion industry (e.g., die plates, die insert, auger blades,wiper blades, etc.). As can be appreciated, many other devices can bemade by the manufacturing process of the present invention.

It will thus be seen that the objects set forth above, among those madeapparent from the preceding description, are efficiently attained, andsince certain changes may be made in the constructions set forth withoutdeparting from the spirit and scope of the invention, it is intendedthat all matter contained in the above description and shown in theaccompanying drawings shall be interpreted as illustrative and not in alimiting sense. The invention has been described with reference topreferred and alternate embodiments. Modifications and alterations willbecome apparent to those skilled in the art upon reading andunderstanding the detailed discussion of the invention provided herein.This invention is intended to include all such modifications andalterations insofar as they come within the scope of the presentinvention. It is also to be understood that the following claims areintended to cover all of the generic and specific features of theinvention herein described and all statements of the scope of theinvention, which, as a matter of language, might be said to falltherebetween. The invention has been described with reference to thepreferred embodiments. These and other modifications of the preferredembodiments as well as other embodiments of the invention will beobvious from the disclosure herein, whereby the foregoing descriptivematter is to be interpreted merely as illustrative of the invention andnot as a limitation. It is intended to include all such modificationsand alterations insofar as they come within the scope of the appendedclaims.

1. A method of manufacturing at least a portion of a processingapparatus comprising: generating electronic representations of aplurality of metal layers, said plurality of metal layers at leastpartially forming said processing apparatus, at least one of said metallayers including a hole, slot, and combinations thereof that is designedto allow fluid flow therethrough when said metal layers are connectedtogether; providing a plurality of metal layers; forming a plurality ofmetal layers into specific shapes based on said electronicrepresentation of said metal layers; stacking and aligning saidplurality of formed metal layers; connecting together said plurality offormed metal layers to form said portion of said processing apparatus,said processing apparatus including at least one fluid channel designedto process fluid flowing therethrough.
 2. The method as defined in claim1, wherein a plurality of said metal layers have an average thickness ofup to about 1000 microns.
 3. The method as defined in claim 1, wherein aplurality of said metal layers include at least one alignment structure.4. The method as defined in claim 1, wherein at least one of said metallayers functions as a catalyst for fluid flowing through said at leastone fluid channel in said processing apparatus.
 5. The method as definedin claim 1, wherein a plurality of said metal layers are at leastpartially formed by at least one lithographic technique.
 6. The methodas defined in claim 1, wherein said step of connecting together includesbrazing together a plurality of metal layers, said brazing metal havinga different composition from said plurality of said metal layers, saidbrazing metal having a melting temperature of at least 10° C. less saidmetal layer said brazing material is coated thereon.
 7. The method asdefined in claim 1, including the step of coating at least one side ofat least one metal layer with a brazing metal.
 8. The method as definedin claim 1, wherein said step of connecting together includes the use ofheat.
 9. The method as defined in claim 1, wherein said step ofgenerating electronic representations includes the steps of generating acomputer image of at least a portion of said processing apparatus andthen sectioning said computer image of said portion of said processingapparatus into a plurality of sectional images that correspond to aplurality of said metal layers.
 10. The method as defined in claim 1,wherein said step of forming includes the step of using at least one ofsaid computer generated images of said metal layers to at leastpartially control the forming of said metal layer.
 12. The method asdefined in claim 1, including the step of forming at least one mask thatis at least partially based from at least one of said generatedelectronic representations and at least partially forming at least oneof said formed metal layers using said mask.
 13. The method as definedin claim 1, including the step of inserting at least one catalyst intosaid at least one fluid channel, said catalyst not formed from saidmetal layers.
 14. The method as defined in claim 1, wherein saidprocessing apparatus includes a furnace element.
 15. The method asdefined in claim 14, wherein said furnace element is designed to combustnatural gas.
 16. The method as defined in claim 15, wherein saidprocessing apparatus includes a reactor or micro-reactor, said reactoror micro-reactor designed to convert at least one by product of saidcombusted natural gas into a liquid alcohol.
 17. A processing apparatuscomprising a plurality of metal layers, at least two of said metallayers including a hole, slot, and combinations thereof that is designedto allow fluid flow therethrough when said metal layers are connectedtogether, at least two of said metal layers connected together by atleast one laminate.
 18. The processing apparatus as defined in claim 17,wherein a plurality of said metal layers are formed by a process ofgenerating electronic representations of a plurality of metal layers,and forming a plurality of metal layers into specific shapes based onsaid electronic representation of said metal layers.
 19. The processingapparatus as defined in claim 17, wherein a plurality of said metallayers are connected together by stacking and aligning said plurality ofmetal layers and then heating said metal layers.
 20. The processingapparatus as defined in claim 17, wherein a plurality of said metallayers have an average thickness of up to about 1000 microns.
 21. Theprocessing apparatus as defined in claim 17, wherein a plurality of saidmetal layers include at least one alignment structure.
 22. Theprocessing apparatus as defined in claim 17, wherein a plurality of saidmetal layers are at least partially formed by at least one lithographictechnique.
 23. The processing apparatus as defined in claim 17, whereina plurality of said metal layers include a brazing metal on at least oneside of said metal layer, said brazing metal having a differentcomposition from said plurality of said metal layers, said brazing metalhaving a melting temperature of at least 10° C. less said metal layersaid brazing material is coated thereon.
 24. The processing apparatus asdefined in claim 17, including at least one catalyst in said at leastone fluid channel, said catalyst not formed from said metal layers. 25.The processing apparatus as defined in claim 17, wherein said processingapparatus includes a furnace portion and a reactor or micro-reactorportion, said furnace portion designed to combust natural gas, saidreactor or micro-reactor designed to convert at least one by product ofsaid combusted natural gas into a liquid alcohol.